A chip packaging method and mold

Abstract

The invention discloses a chip plastic sealing mold, which comprises an upper mold body and a lower mold body. An upper module, a fixed hammer and a support frame are arranged in the mold cavity of the upper mold body. The upper module drives the fixed hammer connected to it to move up and down. The fixed hammer and the fixed hammer The support frames are arranged alternately, a high temperature resistant film is provided between the fixed hammer and the support frame, the fixed hammer is provided with a draft slope, and the hammer surface of the fixed hammer corresponds to the position of the chip carrier on the lead frame. The present invention also provides a chip packaging method, including the following steps: plastic sealing, the fixed hammer drives the film to move down, the film and the fixed hammer are closely attached, and a gap is formed between the support frame, the inclined surface of the fixed hammer and the lead frame; Inject into the mouth, fill the gap, and the cavity in the lower mold; after the filling is completed, the plastic-encapsulated cavity is formed on the lead frame; the patch; the welding wire; the cover. The invention satisfies the current requirement for signal connection between the chip and the outside world, improves the applicability of the chip, and reduces the use of film-clearing glue in the plastic sealing process.

Description

technical field [0001] The invention relates to the field of chip packaging, in particular to a chip plastic packaging method and a mold. Background technique [0002] The packaging process of traditional chips is: SMT——Wire bonding——Plastic sealing. During operation, first clean the mold with clear film glue, then put the plastic sealing material into the equipment, heat the mold, and use the high pressure generated by the stamping head. The molding compound is plasticized and injected from top to bottom, and the molding compound flows along the mold and the lead frame, filling the cavity of the mold and forming. In fact, the chip has been placed before plastic packaging, connected with metal wires, and then plastic sealed. At this time, the chip is fixed. However, since the chip is surrounded by plastic packaging compound after plastic packaging, it is impossible to exchange other information with the outside world except electrical signals. And after plastic sealing, due...

AI Technical Summary

Problems solved by technology

In fact, the chip has been placed before plastic packaging, connected with metal wires, and then plastic sealed. At this time, the chip is fixed, but since the chip is surrounded by plastic packaging compound after plastic packaging, it is impossible to exchange other information with the outside world except electrical signals.

In addition, due to the pollution of the plastic sealant after plastic sealing, the plastic seal mold is dirty, and the mold must be cleaned with clear film glue, resulting in a large amount of use of clear film glue

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