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Chip integrated module, chip package structure and chip integrated method

A technology of integrated modules and integrated methods, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of residual adhesive impurities, poor metal conductivity of conductive adhesives, affecting the yield of semiconductor packaging, etc. Overall size, effect of short interconnect paths

Active Publication Date: 2014-11-19
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of process realization, this method will easily lead to residues of adhesive impurities, which will affect the yield of semiconductor packaging.
In addition, conductive adhesives are less conductive than metals, which can affect the electrical characteristics of integrated passive devices

Method used

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  • Chip integrated module, chip package structure and chip integrated method
  • Chip integrated module, chip package structure and chip integrated method
  • Chip integrated module, chip package structure and chip integrated method

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0045] see figure 1 and figure 2, The first preferred embodiment of the present invention provides a chip integrated module 10 , including a die 11 , a passive device 13 and a connector 15 . The die 11 and the passive device 13 are connected to each other through the connector 15 .

[0046] In this embodiment, the die 11 may be a logic circuit, a storage device or other types of circuits, on which semiconductor elements such as diodes, transistors and capacitors...

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Abstract

The invention provides a chip integrated module, which comprises a pipe core, a passive component and connecting pieces, wherein the pipe core joint parts are arranged on the pipe core; passive component joint parts are arranged on the passive component; the pipe core joint parts of the pipe core and the passive component joint parts of the passive component are oppositely arranged; the connecting pieces are arranged between the pipe core joint parts and the passive component joint parts, and connected with the pipe core joint parts and the passive component joint parts. The chip integrated module provided by the invention is easy to integrate and lower in cost; the interconnection path of the pipe core and the passive component is shorter, so that the performance of the passive component is improved. The invention further discloses a chip package structure and a chip integrated method.

Description

technical field [0001] The invention relates to the field of chip manufacturing, in particular to a chip integration module, a chip packaging structure and a chip integration method. Background technique [0002] Cost, size, and electrical characteristics play a very important role in electronic products, and chips (packaged dies), peripheral devices, and printed circuit boards (PCB, Printed Circuit Board) are the core of electronic products. Among them, the size of the printed circuit board largely determines the cost and size of electronic products. On the other hand, the length of the traces connecting the chip and peripheral devices, the distance between the filter circuit and the power ground determine the electrical characteristics, and at the same time, the smaller the physical size of the device, the better the electrical characteristics. Among the peripheral devices, most of them are passive devices, such as resistors, inductors, and capacitors. If the die can be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/64H01L21/60
CPCH01L2224/11H01L2224/48091H01L2224/73204H01L24/05H01L24/13H01L24/16H01L2224/0345H01L2224/03452H01L2224/0401H01L2224/04042H01L2224/05557H01L2224/05571H01L2224/05624H01L2224/05647H01L2224/48227H01L2224/73207H01L2224/75745H01L2224/81191H01L2224/92125H01L2924/181H01G2/065H01L2224/75744H01L24/03H01L2924/19104H01L2224/16227H01L25/16H01L24/81H01L24/11H01L2224/16268H01L2224/13144H01L2224/13139H01L2224/13147H01L2224/13155H01L2224/13124H01L2224/13166H01L2224/81203H01L2224/81205H01L2224/81193H01L2224/13023H01L2224/13644H01L2224/13611H01L2224/13647H01L2224/13655H01L2224/13664H01L2224/81801H01L2224/1134H01L2924/19041H01L2924/19042H01L2924/19043H01L2924/00014H01L2924/00012
Inventor 符会利高崧
Owner HUAWEI TECH CO LTD
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