Method capable of increasing productivity of back films of inductors

Abstract

The invention provides a method capable of increasing the productivity of back films of inductors. The method capable of increasing the productivity of the back films of the inductors comprises the following steps of preparing materials, wherein a first material plate and the inductors to be machined are prepared; conducting filling, wherein the inductors are arranged in first holes of the first material plate respectively; conducting printing, wherein the first holes of the first material plate are painted and filled with UV glue through a screen printer; conducting assembly and locating, wherein the first material plate is arranged on a base plate, a second material plate is arranged above the first material plate, and finally an upper cover plate is arranged above the second material plate; conducting solidification, the UV glue is irradiated with a UV lamp so that the UV glue can be solidified and formed on the inductors, and then the inductors with machined back films can be obtained. According to the method capable of increasing the productivity of the back films of the inductors, through the printing step, a large amount of glue can be fed at the same time in a screen printing mode, subsequent jig assembly and back film solidifying and forming can be rapidly completed through the assembly and locating step and the solidification step, and therefore the function of greatly increasing the productivity can be achieved.

Description

technical field [0001] The invention relates to a method for processing an inductance back film, in particular to a method capable of increasing the processing output of an inductance back film. Background technique [0002] see figure 1 As shown, the shape of the general inductor 1 is not completely flat because the iron core 10 is not completely flat, so when the product is going to be subjected to SMT (Surface Mount Technology, surface mount technology) operations, in order to facilitate machine suction, the inductor 1 is usually placed without the iron core 10 One side of the electrode terminal is provided with a flat back film 20, please refer to figure 2 As shown, the current industry method for forming the back film 20 on the inductor 1 is mainly to arrange a back film belt 2 on the working area of ​​the dispenser, wherein the back film belt 2 is provided with several Holes 21 with corresponding sizes, and then the glue dispenser sequentially injects UV glue 22 (th...

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Problems solved by technology

[0003] see figure 2 , image 3 As shown, although the existing inductance back film processing method can achieve the purpose of forming the back film 20 on the inductance 1, it is necessary to use a glue dispenser to dispense glue in the holes 21 of the back film belt 2 in sequence, and then place the The inductance 1 to be processed is placed in the hole 21. Since this kind of operation method can only complete the dispensing of a single hole 21 at a time, even if it is all done by mechanical automation, there are still inherent limitations and limits in terms of production capacity; in addition, After the inductor 1 finishes the processing of the back film 20, the back film tape 2 must be destroyed before the inductor 1 can be taken out, that is, the back film tape 2 is a consumable material, which will cause an increase in processing or manufacturing costs. Therefore, how to develop A processing method for inductive back film that can increase production capacity and reduce costs has become a technical topic of great urgency and practical value

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