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Sealed sound cavity, manufacturing method thereof, and electronic device

A technology for electronic equipment and sound chambers, which is applied in electrical components, electrical digital data processing, transducer shells/cabinets/supports, etc. problems, to achieve the effect of reducing manufacturing costs and ensuring sealing performance

Active Publication Date: 2018-07-06
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the current electronic terminal products such as tablet (Pad) computers, the sealing method of the sound cavity generally adopts the box (Box) scheme, that is, the sound cavity pre-sealed by the manufacturer is used, or the flexible printed circuit board (FPC, Flexible Printed Circuit) and foam are used. The solution of cotton forming a sealed sound cavity will increase the manufacturing cost of the finished electronic terminal due to the high cost of the pre-sealed sound cavity and FPC
[0003] It can be seen that the existing sound cavity sealing technology cannot reduce the manufacturing cost of the sound cavity while ensuring the sealing performance of the sound cavity

Method used

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  • Sealed sound cavity, manufacturing method thereof, and electronic device
  • Sealed sound cavity, manufacturing method thereof, and electronic device
  • Sealed sound cavity, manufacturing method thereof, and electronic device

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Embodiment Construction

[0045] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0046] An embodiment of the present invention provides a sealed sound cavity, which is applied to an electronic device with a speaker, and the sealed sound cavity is located between a first casing and a second casing of the electronic device.

[0047] Figure 1a and Figure 1b are respectively the structural schematic diagrams of the first housing and the second housing of the first embodiment of the present invention, such as Figure 1a The shown first housing is provided with a first foam 1, and the position of the first foam 1 is set at Figure 1b The position of the surrounding sealing wall 2 in the shown second housing corresponds; where,

[0048] The loudspeaker 3 is arranged in the area of ​​the first foam 1, and the loudspeake...

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Abstract

Embodiments of the present invention provide a sealed sound chamber, a manufacturing method thereof, and an electronic device. The sealed sound chamber is applied to an electronic device with a speaker and is located between a first housing and a second housing of the electronic device; the second housing There is a surrounding sealing wall in the body, and the first foam is arranged in the position corresponding to the sealing wall in the first shell; when the first shell and the second shell are buckled together, the sealing wall is against the first foam, The loudspeaker is sealed in the space formed by the first casing, the second casing, the sealing wall and the first foam to form a sealed sound cavity. The technical solution of the embodiment of the present invention reduces the manufacturing cost of the sound cavity while ensuring good sealing performance of the sound cavity.

Description

technical field [0001] The invention relates to sound chamber processing technology, in particular to a sealed sound chamber, a manufacturing method thereof, and electronic equipment. Background technique [0002] In the current electronic terminal products such as tablet (Pad) computers, the sealing method of the sound cavity generally adopts the box (Box) scheme, that is, the sound cavity pre-sealed by the manufacturer is used, or the flexible printed circuit board (FPC, Flexible Printed Circuit) and foam are used. The solution of forming a sealed sound cavity with cotton will increase the manufacturing cost of the finished electronic terminal because the cost of the pre-sealed sound cavity and the FPC is relatively high. [0003] It can be seen that the existing sound cavity sealing technology cannot reduce the manufacturing cost of the sound cavity while ensuring the sealing performance of the sound cavity. Contents of the invention [0004] In view of this, the techn...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/02H04R31/00G06F1/16
Inventor 丁雪冬
Owner LENOVO (BEIJING) LTD
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