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Printed circuit board and method of manufacturing the same

A printed circuit board, circuit layer technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of high-density interlayer connection limitation, can not be used in production technology and other problems

Inactive Publication Date: 2015-01-14
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the related technologies mentioned above have the limitation of high-density interlayer connections and cannot be adopted as a complete production technology

Method used

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  • Printed circuit board and method of manufacturing the same
  • Printed circuit board and method of manufacturing the same
  • Printed circuit board and method of manufacturing the same

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Embodiment Construction

[0044]The objects, features and advantages of the present invention will be more clearly understood from the following detailed description of preferred embodiments in conjunction with the accompanying drawings. Throughout the drawings, the same reference numerals are used to designate the same or similar components, and redundant descriptions thereof are omitted. Further, in the following description, the terms "first", "second", "one side", "another side", etc. are used to distinguish a certain component from other components, but the configuration of these components should not be construed as being limited by these terms. Further, in the description of the present invention, when it is determined that a detailed description of related arts will make the gist of the present invention unclear, their description will be omitted.

[0045] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[00...

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PUM

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Abstract

A printed circuit board includes an insulating layer; a via in the insulating layer, a first circuit layer formed at a first side of the insulating layer and having a portion buried in the via; a second circuit layer formed at a second side of the insulating layer and electrically connected with the portion of the first circuit layer in the via.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2013-0080440, filed Jul. 9, 2013, entitled "Printed Circuit Board and Method of Manufacturing the Same," the contents of which are incorporated by reference in this. technical field [0003] Embodiments of the present invention relate to printed circuit boards and methods of manufacturing the same. Background technique [0004] With the development of the electronics industry, improvements in performance and functions of electronic components and miniaturization of electronic components are required. Therefore, a high-density surface board on which components such as semiconductor packages are mounted appears important. As described above, in order to meet demands for an increase in board density and board thickness, high-density interlayer connections of circuit patterns are required. [0005] The technique by electroplating is a scheme of proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/09H05K3/40H05K3/46
CPCH05K1/18H05K1/115H01L23/49816H01L23/49827H01L2224/16225H01L2924/15311H05K1/111H05K1/144H05K3/0038H05K3/0097H05K3/025H05K3/428H05K3/4682H05K2201/042H05K2201/09545H05K2201/09563H05K2201/10666H05K2203/1536H01L24/13H01L24/16H01L24/81H01L25/105H01L25/50H01L2224/131H01L2224/16227H01L2224/81192H01L2224/81815H01L2225/1023H01L2225/1058H01L2924/15313H01L2924/1533H01L2924/013H01L2924/00014H05K3/40H05K3/46
Inventor 李在洙
Owner SAMSUNG ELECTRO MECHANICS CO LTD