Resilience compensation factor obtainment method based on optimization method
An optimization method, springback compensation technology, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve the problem that the size of parts does not meet the design requirements, to avoid repeated adjustments, accurate and easy to implement, Effects of Improving Analytical Efficiency
Inactive Publication Date: 2015-01-21
INST OF IND TECH GUANGZHOU & CHINESE ACADEMY OF SCI
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Therefore, in the process of making stamping parts, when the stamping parts withdraw from the stamping die, the stamping parts will spring back, and the size of the stamping parts after forming is no longer equal to the size of the geometric surface of the stamping die. If the geometric shape of the part design Due to the impact of springback on the geometrical surface of the stamping die, the size of the final processed part will not meet the design requirements
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[0014] A method for obtaining the springback compensation coefficient based on the optimization method of the present invention includes the following steps: A. Taking the springback compensation coefficient as a design variable, taking the node distribution of the geometric profile after the stamping springback simulation of the part and the geometric profile of the part design The difference between the node distribution of the part is used as the objective function; B. Mesh the part design geometric surface to obtain the node distribution of the part design geometric surface; C. Use the finite element analysis method to analyze the nodes of the part design geometric surface Perform the initial stamping springback simulation analysis to obtain the node distribution of the geometric surface after the part stamping springback simulation; D. Set the value range of the springback compensation coefficient, and randomly generate the springback compensation coefficient in the value r...
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Disclosed is a resilience compensation factor obtainment method based on an optimization method. According to the resilience compensation factor obtainment method based on the optimization method, resilience compensation factors are used as design variables, a difference value between nodes distribution of geometric profile after part punching resilience simulation and nodes distribution of part design geometric profile is used as a target function, an engineering problem is described as a mathematical problem, the resilience compensation factors which meet design requirements are searched on the basis of the optimization method, a punching resilience simulation analysis process is nested in an optimization algorithm, intelligentizing of punching resilience simulation analysis can be achieved, repeated adjustment of the resilience compensation factors by an engineer can be avoided, the optimum resilience compensation quantity of a punching part can be rapidly and effectively obtained, the analysis efficiency of the engineer can be increased, and the period of generation of the geometric profile after part resilience compensation is shortened.
Description
technical field [0001] The present invention mainly relates to the technical field of mold surface design for stamping parts, in particular to a method for obtaining springback compensation coefficients based on an optimization method. Background technique [0002] The so-called springback refers to the final stage of sheet metal forming. With the disappearance of the deformation force, the elastic deformation stored in the forming process can be released, causing the reorganization of internal stress, which in turn leads to the change of the overall shape of the part. Therefore, in the process of making stamping parts, when the stamping parts withdraw from the stamping die, the stamping parts will spring back, and the size of the stamping parts after forming is no longer equal to the size of the geometric surface of the stamping die. If the geometric shape of the part design Due to the impact of springback on the geometric profile of the stamping die for surface processing,...
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IPC IPC(8): G06F17/50
Inventor 马荣鑫刘红武丁桦
Owner INST OF IND TECH GUANGZHOU & CHINESE ACADEMY OF SCI