A method for longitudinal cutting of side panels of liquid crystal glass substrates

Abstract

A method for longitudinally cutting a side panel of a liquid crystal glass substrate, comprising clamping the liquid crystal glass substrate with clamping jaws of a tooling plate and transporting it to a slitting station, then clamping the liquid crystal glass substrate by a slitter before and after, and opening the tooling plate The cutter wheels on both sides of the slitting machine cut the side plate of the liquid crystal glass substrate longitudinally from top to bottom. After the cutting is completed, restart the grippers to clamp the liquid crystal glass substrate. Before opening the slitting machine, rely on the sealing strip. After passing through the slitting machine, rely on the suction cups on both sides of the cutting board to break the board. After breaking the board, the knife wheels on both sides of the slitting machine return to the original position from bottom to top. The conveyor belt transports the broken liquid crystal glass substrate to the next station. In the cutting process of the present invention, the upward pulling force of the jaws on the glass substrate is reduced, and the breakage caused by cutting the glass substrate is avoided. At the same time, the sealing strip is used to loosen the front of the breaking board, preventing the liquid crystal glass substrate from being hit by the breaking board. The slitting machine produces scratches.

Description

technical field [0001] The invention belongs to the field of processing and manufacturing liquid crystal glass substrates, and in particular relates to a method for longitudinally cutting side plates of liquid crystal glass substrates. Background technique [0002] In the manufacturing process of liquid crystal substrate glass, the overflow-drawn glass plate is cut and broken into single pieces by a cross-cutting machine, hung on the semi-finished conveyor belt, and then sent to the slitting station for longitudinal cutting of the side plates on both sides , forming the initial glass substrate. For the glass substrate of the sixth-generation production line, its length is about 2 meters, its width is about 1.6 meters, and its weight is about 5000 grams. Up and down or left and right movement occurs during transportation, which makes it impossible to cut after arriving at the slitting station. In order to ensure stable clamping, increasing the clamping force will easily caus...

AI Technical Summary

Problems solved by technology

[0003] In the current cutting method, the glass substrate will be subjected to an upward pulling force due to the clamping of the three jaws. The front and rear leans on the slitting machine clamp the glass substrate, so that the glass substrate is subjected to a pressure, and the cutter wheels on both sides cut the edge of the glass substrate longitudinally. The glass substrate is also subjected to a cutting pressure when the board is cut, and the three external forces are superimposed, which may easily cause the glass substrate to be chopped and split. scratch

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