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A dispensing pressurizing mechanism

A pressurizing mechanism and glue dispensing technology, which is applied in the direction of coating, liquid coating device on the surface, etc., can solve the problems of affecting the yield, large operation error, low efficiency, etc., and achieve the effect of easy control and smooth glue discharge

Active Publication Date: 2017-03-01
BOZHON PRECISION IND TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, it is all manual operation, and the control of the dispensing position and the amount of glue is not accurate, which also affects the yield
At the same time, manual operation has large errors, low efficiency and high labor intensity

Method used

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  • A dispensing pressurizing mechanism
  • A dispensing pressurizing mechanism

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Experimental program
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Embodiment Construction

[0020] Examples, see attached figure 1 and 2 , a dispensing and pressing mechanism, which includes a mounting base 1, a motor 2, a reducer 3, a reducer connecting plate 4, a coupling 5, a linear module 6 and a linear module slider 7, the linear module Installed on the mounting base, the motor is installed on the reducer, the reducer is installed on the linear module through the reducer connecting plate, and connected with the linear module through the coupling; the linear module is matched with the installation There is a linear module slider, and the motor drive can drive the linear module slider to move up and down along the linear module.

[0021] A mounting bar 8 is installed on the mounting base, and three photoelectric sensors 9 are installed on the mounting bar. The side of the linear module slide block is equipped with an induction sheet 10 matched with the photoelectric sensor, and the distance that the linear module moves up and down is determined by The photoelect...

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Abstract

The invention relates to a dispensing and pressurizing mechanism. A linear module and an installing bar are respectively arranged on an installing base, a motor is arranged on a speed reducer, the speed reducer is connected with the linear module by means of a coupler; a linear module sliding block is arranged on the linear module; a photoelectric sensor is arranged on the installing base, an induction sheet is arranged on the side surface of the linear module sliding block; an ejector pin retaining plate is arranged on the linear module sliding block, an ejector pin fixing block is arranged on the ejector pin retaining plate; a weighing sensor is matched and installed at the lower side of the ejector pin fixing block; a sliding rail is arranged on the ejector pin fixing block, a sliding block is arranged on the sliding rail, a sliding block connecting plate is fixedly arranged on the sliding block, an ejector pin fixing base is fixedly arranged at the rear side of the lower part of the sliding block connecting plate; an ejector pin is connected to the lower end of the ejector pin fixing base, the lower end of the ejector rod is provided with a piston by means of a piton floating head, a rubber cylinder is connected to the lower end of the piston, the lower end of the rubber cylinder is communicated with a rubber cylinder adapter; and the rubber cylinder is fixed on a rubber cylinder fixing base. The dispensing and pressurizing mechanism is driven by the motor, and the ejector pin is driven by the linear module sliding block to push the piston to be capable of pressurizing the inner part of the rubber cylinder.

Description

[0001] Technical field: [0002] The invention relates to the field of glue dispensing mechanism equipment, and more specifically relates to a glue dispensing and pressing mechanism. [0003] Background technique: [0004] In the process of PCB board manufacturing, dispensing will be applied in many places. When dispensing glue, it is necessary to move the dispensing needle to the standard operating position through the X-axis mechanism, Y-axis mechanism, and Z-axis mechanism; The glue in the glue valve is pressurized; at the same time, it is necessary to precisely control the dispensing position and the amount of glue to ensure the accuracy of the dispensing process. In the prior art, it is all manual operation, and the control of the dispensing position and the amount of glue is not accurate, which also affects the yield. At the same time, manual operation has large errors, low efficiency and high labor intensity. At this point, a glue dispensing and pressurizing mechanism...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C11/10
CPCB05C11/10
Inventor 吕绍林马金勇孙卫东赵永存刘治渊唐国成
Owner BOZHON PRECISION IND TECH CO LTD
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