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Novel Bluetooth headset device and manufacturing method thereof

A Bluetooth headset, a new type of technology, applied in the directions of earpieces/headphone accessories, sensors, electrical components, etc., can solve the problems of occupying physical space, not thin, complex circuit structure, etc., achieving simple steps, miniaturization, and saving internal space. Effect

Active Publication Date: 2015-02-04
COSONIC INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, circuit boards are indispensable on Bluetooth devices, and the circuit structure is relatively complicated. Most of them are made of multi-layer boards. The existing Bluetooth circuits are supported by printed circuit boards to form circuits on a plane. These supports The material will occupy a certain physical space; but what people pursue is portability and compactness, which has become the standard for people to measure a product. The Bluetooth circuit structure determines the size of the Bluetooth, and many Bluetooth products are therefore not small. not thin

Method used

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  • Novel Bluetooth headset device and manufacturing method thereof
  • Novel Bluetooth headset device and manufacturing method thereof
  • Novel Bluetooth headset device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] like Figure 1-3 As shown, a novel bluetooth earphone device includes a structural part 1, and the structural part 1 includes an upper cover 2, a lower cover 3 and a support member 4, the lower surface of the lower cover 3 is provided with earplugs 5, and the upper cover 2 and the lower cover 3 cover each other to form a storage space, the support 4 is accommodated in the storage space, the support 4 is provided with a pit 41 and a through hole 42, and the support 4 is provided with a Bluetooth antenna 9. A three-dimensional circuit 6 is formed on the surface of the support member 4, and electronic components 7 are fixedly connected to the three-dimensional circuit 6. The bluetooth antenna can be located at any position of the support 4, can be buried in a pit 41, and does not need to take up space; the circuit board is omitted, the support 4 plays the role of supporting the three-dimensional circuit 6, and the support 4 is Three-dimensional, so the circuit formed on t...

Embodiment 2

[0033] like Figure 1-3 As shown, a novel bluetooth earphone device includes a structural part 1, and the structural part 1 includes an upper cover 2, a lower cover 3 and a support member 4, the lower surface of the lower cover 3 is provided with earplugs 5, and the upper cover 2 and the lower cover 3 cover each other to form a storage space, the support 4 is accommodated in the storage space, a pit 41 is opened on the support 4, and a three-dimensional circuit 6 is formed on the surface of the support 4, so Electronic components 7 are fixedly connected to the three-dimensional circuit 6 .

[0034] Further, the structural member 1 is also provided with a USB connection port 8 , and the electronic components 7 include a memory chip 71 , an electroacoustic transducer 72 and a control switch 73 .

Embodiment 3

[0036] The preparation method of the novel bluetooth earphone device described in embodiment 1 comprises the following steps:

[0037] 1) first forming pits and through holes on the support;

[0038] 2) Adsorb a layer of copper powder on the support with pits and through holes;

[0039] 3) Place the structural part that has absorbed the copper powder in step 2 in a nitrogen atmosphere, and then the laser machine loaded with the designed circuit pattern selectively scans the copper powder, and the scanned copper powder is instantly melted, and it is compatible with the support. Welding to form a three-dimensional circuit, and then use machine vibration to shake off the unscanned copper powder;

[0040] 4) Finally, assemble the electronic components in a small package on the three-dimensional circuit in the pit of the support member, assemble the electronic components in a large package on the three-dimensional circuit on the surface of the plastic structural member, and assemb...

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Abstract

The invention relates to the technical field of Bluetooth headset devices and manufacturing methods thereof, and particularly relates to a novel Bluetooth headset device and a manufacturing method thereof. The novel Bluetooth headset device comprises a structural piece; the structural piece comprises an upper cover, a lower cover and a supporting piece; the lower surface of the lower cover is provided with an earplug; the upper cover and the lower cover are mutually covered to form an accommodating space; the supporting piece is accommodated inside the accommodating space; the supporting piece is provided with pits or through holes; stereo circuits are formed on the surface of the supporting piece; and electronic elements are fixedly connected onto the stereo circuit. a circuit board is saved, the supporting piece plays the role of supporting the stereo circuit, small electronic elements are assembled in the pits, large electronic elements are assembled on the surface of the supporting piece, multiple layers of electronic elements are formed, the space is saved, the Bluetooth headset device is manufactured to be light and thin, the through holes conduct the stereo circuits on two faces of the supporting piece for manufacturing the complicated stereo circuit, miniaturization of the Bluetooth headset device is realized, the manufacturing method is simple in steps, the product is reliable, the service life is long, and popularization and application are facilitated.

Description

technical field [0001] The invention relates to the technical field of a bluetooth earphone device and a preparation method thereof, in particular to a novel bluetooth earphone device and a preparation method thereof. Background technique [0002] At present, circuit boards are indispensable on Bluetooth devices, and the circuit structure is relatively complicated. Most of them are made of multi-layer boards. The existing Bluetooth circuits are supported by printed circuit boards to form circuits on a plane. These supports The material will occupy a certain physical space; but what people pursue is portability and compactness, which has become the standard for people to measure a product. The Bluetooth circuit structure determines the size of the Bluetooth, and many Bluetooth products are therefore not small. Do not thin. [0003] Therefore, there is an urgent need to provide a novel bluetooth earphone device and a preparation method thereof, so as to solve the deficiencies...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10H04R31/00
Inventor 胡平
Owner COSONIC INTELLIGENT TECH CO LTD