Method for forming tin coating on conductive substrate and electrical contact terminal manufactured by method
A technology of electrical contact terminals and conductive substrates, applied in cable/conductor manufacturing, metal material coating process, coating and other directions, can solve the problems of large insertion force, large friction coefficient of tin surface, etc. Effect
Active Publication Date: 2015-02-11
TYCO ELECTRONICS (SHANGHAI) CO LTD
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Problems solved by technology
However, when the tin plating layer formed by this tin plating process is used as the contact interface of the terminal, due to the large surface friction coefficient of the remaining tin, the insertion force is often too large
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[0035] The technical solutions of the present invention will be further specifically described below through the embodiments and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals designate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept of the present invention, but should not be construed as a limitation of the present invention.
[0036] Figure 1A A perspective view showing a conductive substrate 100 according to an exemplary first embodiment of the present invention; Figure 1B show on Figure 1A A schematic diagram of the surface 101 of the conductive substrate 100 after processing to form a corrugated profile. figure 2 show Figure 1B A cross-sectional view of the conductive substrate 100.
[0037] Such as Figure 1A As shown, a conductive substrate 100 is first...
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Abstract
The invention discloses a method for forming a tin coating on a conductive substrate. The method comprises the following steps of providing the conductive substrate; processing to form multiple mutually parallel grooves on the surface of the conductive substrate so as to form a waviness profile with peaks and troughs on the surface of the conductive substrate; immersing the conductive substrate into molten tin liquor so as to generating intermetallic compound on a contact interface between the tin liquor and the conductive substrate; taking the conductive substrate from the tin liquor, controlling the thickness of the tin coating on the surface of the conductive substrate, enabling the intermetallic compound at the peak position to grow to the outside of the tin coating and expose from the tin coating, and enabling the intermetallic compound at the trough position not to grow to the outside of the tin coating, so that multiple mutually parallel intermetallic compound strips are formed on the surface of the tin coating. Through the method provided by the invention, the tin coating with friction performance anisotropy can be realized, so that the application occasions of products can be expanded, and different actual demands can be met.
Description
technical field [0001] The invention relates to a method for forming a tin plating layer on a conductive base material and an electrical contact terminal made by the method. Background technique [0002] In the prior art, it is sometimes necessary to form a layer of tin plating on the electrical contact terminals in order to protect the conductive substrate. At present, the tin plating method used is the reflow tin plating process, which mainly includes the following steps: first electroplate a layer of tin layer on the surface of the conductive substrate; then put the conductive substrate electroplated with the tin layer into the reflow furnace, The tin layer is re-melted and solidified on the surface of the conductive substrate through a reflow furnace, and finally forms a layer of intermetallic compound (IMC) at the contact interface between the conductive substrate and the tin layer, thereby firmly attaching the tin layer to the conductive substrate. On the substrate, t...
Claims
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IPC IPC(8): H01B1/02H01B13/00C23C2/08
Inventor 周建坤高婷
Owner TYCO ELECTRONICS (SHANGHAI) CO LTD