System and method for indirectly measuring stress distribution of assembly combined surfaces
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- DALIAN UNIV OF TECH
- Publication Date
- 2015-02-18
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Abstract
Description
technical field
[0001] The invention relates to the technical field of assembly measurement, in particular to a system and method for indirect measurement of stress distribution on an assembly joint surface. Background technique
[0002] All kinds of machinery are assembled from various parts according to specific requirements, and the surface where the parts are combined and contacted is called "joining surface". The study found that the mechanical properties of the joint surface have a significant impact on the overall characteristics of the mechanical equipment, and the stiffness, damping, and static deformation of the mechanical equipment all come from the joint surface. The stress distribution law of the joint surface is an important aspect of the joint surface characteristics, which has an important impact on the static and dynamic characteristics of the joint surface.
[0003] The existing methods for measuring the stress distribution of the joint surface mainly incl...