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Applications of silicon-containing organic compound in prolonging of stability of grinding particles in chemical mechanical polishing liquid

An organic compound, chemical-mechanical technology, applied in polishing compositions containing abrasives, etc., can solve problems such as accelerated nanoparticle sedimentation

Active Publication Date: 2015-02-25
ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, through experiments, it is also found that the silane coupling agent is not in the entire concentration range, but only in a specific concentration range to play the role of a stabilizer. Excessively high silane coupling agent concentration will accelerate the nanometer process. Settling of particles

Method used

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  • Applications of silicon-containing organic compound in prolonging of stability of grinding particles in chemical mechanical polishing liquid
  • Applications of silicon-containing organic compound in prolonging of stability of grinding particles in chemical mechanical polishing liquid
  • Applications of silicon-containing organic compound in prolonging of stability of grinding particles in chemical mechanical polishing liquid

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Embodiment Construction

[0046] The advantages of the present invention are further described below through specific examples, but the protection scope of the present invention is not limited only to the following examples.

[0047] Prepare the polishing solution according to the ingredients and proportions of each example and comparative example in Table 1, mix well, and make up the mass percentage to 100% with water. with KOH or HNO 3 Adjust to desired pH. The polishing conditions are as follows: the polishing machine is Mirra machine, Fujibo polishing pad, 200mm Wafer, downforce 3psi, polishing droplet velocity 150ml / min.

[0048] Table 1 Concrete embodiment of the present invention and comparative example formula

[0049]

[0050] As can be seen from comparative examples 1 and 2, high ionic strength is conducive to improving the polishing rate of polysilicon, and as can be seen from comparative examples 1, 2, 3 and 4, without silane coupling agent, and under high ionic strength ( >0.1mol / Kg)...

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Abstract

The invention relates to applications of a silicon-containing organic compound in prolonging of the stability of grinding particles in a chemical mechanical polishing liquid. According to the present invention, the dispersion stability of the chemical mechanical polishing liquid at the high ion strength is achieved through the silane coupling agent, wherein the grinding particles in the polishing liquid added with the silane coupling agent can maintain the dispersion stability for a long time.

Description

technical field [0001] The invention relates to the application of a silicon-containing organic compound in prolonging the stability of grinding particles in a chemical mechanical polishing liquid. Background technique [0002] With the continuous development of semiconductor technology and the continuous increase of interconnection layers in large-scale integrated circuits, the planarization technology of conductive layers and insulating dielectric layers has become particularly critical. In the 1980s, the chemical mechanical polishing (CMP) technology pioneered by IBM is considered to be the most effective method for global planarization. [0003] Chemical Mechanical Polishing (CMP) consists of chemical action, mechanical action, and a combination of both. It usually consists of a grinding table with a polishing pad, and a grinding head for carrying chips. The grinding head holds the chip and presses the front side of the chip against the polishing pad. When chemical me...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 高嫄王晨何华锋周文婷
Owner ANJI MICROELECTRONICS (SHANGHAI) CO LTD