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High-power pressed connection type IGBT module current detection method

A current detection and crimping type technology, which is applied in the direction of measuring current/voltage, measuring device, measuring electrical variables, etc., can solve the problems of unbalanced current distribution of IGBT chip, damage of IGBT chip, etc., and achieve parallel current sharing control and protection , to achieve the effect of module parallel current balance

Active Publication Date: 2015-03-25
STATE GRID CORP OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Parallel connection of a large number of IGBT chips or modules will lead to unbalanced current distribution of IGBT chips, and IGBT chips with high current will be damaged

Method used

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  • High-power pressed connection type IGBT module current detection method
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  • High-power pressed connection type IGBT module current detection method

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Embodiment Construction

[0039] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention, but should not be construed as limiting the present invention.

[0040] In order to meet the needs of the prior art, the present invention provides a high-power crimping type IGBT module current detection method, the specific steps are as follows figure 1 Shown:

[0041] 1. Embed the Rogowski coil into the package of the crimping type IGBT to collect the current signal of the IGBT chip.

[0042] The structure of crimping IGBT is:

[0043] It includes an upper metal plate and a lower metal plate. The lower metal plate includes bosses arranged at equal intervals, and the ...

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PUM

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Abstract

The invention provides a high-power pressed connection type IGBT module current detection method. The method includes the steps of firstly, embedding rogowski coils in a package of a pressed connection type IGBT, and collecting current signals in IGBT chips; secondly, regulating drive signals of the IGBT chips according to the current signals through a master control unit of the pressed connection type IGBT so that the current of the IGBT chips can be balanced, sleeving a boss corresponding to each IGBT chip with the corresponding rogowski coil if the pressed connection type IGBT is formed by connecting N IGBT chips in parallel, and using the bosses corresponding to the N IGBT chips in each IGBT module as a boss set and sleeving the boss set of each IGBT module with the corresponding rogowski coil if the pressed connection type IGBT comprises M IGBT modules which are connected in parallel and each IGBT module is formed by connecting N IGBT chips in parallel. Compared with the prior art, by means of the high-power pressed connection type IGBT module current detection method, the paralleled current sharing control and protection can be achieved for the high-power IGBT.

Description

Technical field [0001] The invention relates to an IGBT module current detection method, in particular to a high-power crimping type IGBT module current detection method. Background technique [0002] With the large-scale integration of new energies such as wind power and solar energy, energy allocation has changed. Renewable energy such as wind power and solar energy has the characteristics of intermittent and decentralized. At the same time, traditional DC transmission technology is not easy to realize the network and multi-terminal DC grid. , It is difficult to meet the current grid development needs. In order to meet the requirements of the power grid, the use of flexible DC transmission based on IGBTs and other switchable power electronic devices can solve the above-mentioned DC grid networking and multi-terminal problems. Therefore, the power market has an increasing demand for megawatt-level high-power converters. [0003] High-power IGBTs include welded IGBTs and crimped I...

Claims

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Application Information

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IPC IPC(8): G01R19/00
Inventor 温家良陈中圆李金元王志霞李现兵苏莹莹
Owner STATE GRID CORP OF CHINA