A kind of automatic laser drilling equipment

Abstract

The invention provides an automatic laser punching device which comprises an operation platform, a feeding positioning device, a laser head component and a controller, wherein the operation platform comprises a single chip microcomputer control box and a display; the single chip microcomputer control box is used for setting operating parameters; the display is used for displaying operating information; the feeding positioning device is used for positioning and conveying a material to a processing position; the laser head component is used for processing the material on the processing position. A worker can set the operating parameters of equipment through the single chip microcomputer control box, an acting instruction is sent to the feeding positioning device and the laser head component by the controller after the information of the operating parameter is received by the controller, and the feeding positioning device and the laser head component automatically cooperate with each other and finish the operations of loading, processing, unloading, and the like. The automatic laser punching device provided by the invention can accurately punch the material; the punching size, quantity, array, and the like can be quickly set; the laser punching efficiency is greatly increased; the cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of automatic industrial processing, and in particular relates to an automatic laser drilling device capable of automatically controlling loading and unloading and laser drilling. Background technique [0002] In the field of industrial processing technology, through-holes are usually formed on the material by die punching. However, with the development of micro-electromechanical technology, the materials to be processed are getting smaller and smaller, and the diameter of the through-holes that need to be processed is gradually shrinking. . In micro-electromechanical technology, taking the metal case of a silicon microphone as an example, in order to improve the performance of the product, it is necessary to process any micro-hole matrix of tens of microns on the metal case. However, due to the limitations of the traditional blanking technology due to factors such as molds and material properties, the hole ...

AI Technical Summary

Problems solved by technology

[0004] However, laser processing also puts forward higher requirements on the processing technology

First of all, the laser beam is easy to cause damage to tooling, materials, especially staff

Secondly, laser processing is a precision processing method, and issues such as material positioning and laser control cannot be simply achieved manually by staff

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