Rigid-flex board and its cover film window-opening grounding method

A technology of flexible and rigid boards and grounding methods, which is applied in the manufacture of multilayer circuits, electrical components, and printed circuits. It can solve the problems of poor tape precision, missing stickers, and low efficiency, so as to avoid manpower and material resources and improve product reliability. The effect of high reliability and high production efficiency

Active Publication Date: 2017-10-03
台山市精诚达电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the disadvantage is that the accuracy of manual tape application is poor, the efficiency is low, and it is easy to cause leakage

Method used

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  • Rigid-flex board and its cover film window-opening grounding method
  • Rigid-flex board and its cover film window-opening grounding method
  • Rigid-flex board and its cover film window-opening grounding method

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Embodiment Construction

[0026] In order to describe in detail the technical content, the achieved objectives and effects of the present invention, the following description will be given in conjunction with the embodiments and accompanying drawings.

[0027] The most critical idea of ​​the present invention is that the grounding position of the inner cover film is used without windowing treatment first, and the windowing treatment step is placed after the solder mask spraying step is completed, and the laser is used to target the bottom of the hard board substrate slot The inner cover film is grounded and opened, and the inner cover film is burned by a laser to form a ground window and expose the inner circuit of the FPC, and an electromagnetic shielding layer is attached to form a ground connection.

[0028] Please refer to figure 1 , A method for opening a window of the cover film of a flexible and hard board, including the following steps:

[0029] S01. Prepare FPC inner layer substrate and hard board su...

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PUM

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Abstract

The invention provides a method for opening a window and grounding a soft-rigid board and its cover film, wherein the method includes the following steps: S01, preparing an FPC inner layer base material and a hard board base material, and placing the FPC inner layer base material on the FPC inner layer base material Etch the FPC inner layer circuit on the surface and / or the lower surface; S02, paste the inner layer cover film on the upper surface and / or lower surface of the FPC inner layer substrate with the FPC inner layer circuit; S03, paste the hard board substrate On the FPC inner layer base material on the inner layer cover film, and open a slot on the hard board base material to expose the inner layer cover film, and form a soft-rigid combination board; S04. The inner cover film is grounded and window-opened, and the inner cover film is burned by laser to form a ground window and expose the FPC inner layer circuit; S05. After burning, paste an electromagnetic shielding layer on the FPC inner layer circuit to form a grounding conductor Pass. The invention has high production efficiency, good board quality and low production cost.

Description

Technical field [0001] The invention relates to the technical field of circuit boards, in particular to a flexible and hard combined board and a method for grounding a window with a cover film. Background technique [0002] The conventional method of grounding the electromagnetic shielding film (EMI) of the inner layer of the flexible and rigid board is that the inner cover film is first opened and then attached to the inner flexible circuit board (FPC), and the inner flexible circuit board (FPC) is exposed The fenestration pad is connected to the electromagnetic shielding film grounding, thereby playing the role of grounding; however, the inner grounded fenestration PAD (the pad grounded to the electromagnetic shielding film) is exposed in the previous process, and the strong acid and alkali in the subsequent process Under the circumstances, the exposed inner layer of the previous process will be bitten by the open window PAD, so protective measures must be taken. [0003] The ex...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/36H05K3/46
Inventor 苏章泗刘振华王志强
Owner 台山市精诚达电路有限公司
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