The invention provides a soft and rigid combination board and a cover film windowing and grounding method thereof. The method comprises the following steps of S01, preparing an FPC (Flexible Printed Circuit) internal layer base material and a hard board base material, and etching an FPC internal layer circuit(s) on the upper surface and/or the lower surface of the FPC internal layer base material; S02, pasting an internal layer cover film(s) on the upper surface and/or the lower surface of the FPC internal layer base material pasted with the FPC internal layer circuit(s); S03, pasting the hard board base material on the FPC internal base material on the internal layer cover films, opening a slot in the hard board base material, and exposing the internal layer cover films to form the soft and rigid combination board; S04, using laser to carry out grounding and windowing processing on the internal layer cover films on the bottom part of the slot of the hard board base material, and scorching the internal layer cover films through the laser to form a grounding window, and exposing the FPC internal layer circuits; S05, after scorching, pasting electromagnetic shielding layers on the exposed FPC internal layer circuits to form grounding continuity. According to the soft and rigid combination board and the cover film windowing and grounding method thereof, the production efficiency is high, the quality of the board is good, and the production cost is low.