Soft and rigid combination board and cover film windowing and grounding method thereof

A soft-rigid combination board, grounding method technology, applied in the direction of multi-layer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve the problems of missing stickers, poor tape accuracy, low efficiency, etc., to avoid manpower and material resources and high production efficiency , The effect of improving product reliability

Active Publication Date: 2015-04-08
台山市精诚达电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the disadvantage is that the accuracy of manual tape application is poor, the efficiency is low, and it is easy to cause leakage

Method used

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  • Soft and rigid combination board and cover film windowing and grounding method thereof
  • Soft and rigid combination board and cover film windowing and grounding method thereof
  • Soft and rigid combination board and cover film windowing and grounding method thereof

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Embodiment Construction

[0026] In order to describe in detail the technical content, the achieved objectives and effects of the present invention, the following description will be given in conjunction with the embodiments and the accompanying drawings.

[0027] The most critical idea of ​​the present invention is that the grounding position of the inner cover film is used without windowing treatment first, and the windowing treatment step is placed after the solder mask spraying step is completed, and the laser is used to target the bottom of the hard board substrate slot The inner cover film is grounded and opened, and the inner cover film is burned by a laser to form a ground window and expose the inner circuit of the FPC, and an electromagnetic shielding layer is attached to form a ground connection.

[0028] Please refer to figure 1 , A method for opening the window of the cover film of the flexible and hard board, including the following steps:

[0029] S01. Prepare FPC inner layer substrate and hard ...

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PUM

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Abstract

The invention provides a soft and rigid combination board and a cover film windowing and grounding method thereof. The method comprises the following steps of S01, preparing an FPC (Flexible Printed Circuit) internal layer base material and a hard board base material, and etching an FPC internal layer circuit(s) on the upper surface and/or the lower surface of the FPC internal layer base material; S02, pasting an internal layer cover film(s) on the upper surface and/or the lower surface of the FPC internal layer base material pasted with the FPC internal layer circuit(s); S03, pasting the hard board base material on the FPC internal base material on the internal layer cover films, opening a slot in the hard board base material, and exposing the internal layer cover films to form the soft and rigid combination board; S04, using laser to carry out grounding and windowing processing on the internal layer cover films on the bottom part of the slot of the hard board base material, and scorching the internal layer cover films through the laser to form a grounding window, and exposing the FPC internal layer circuits; S05, after scorching, pasting electromagnetic shielding layers on the exposed FPC internal layer circuits to form grounding continuity. According to the soft and rigid combination board and the cover film windowing and grounding method thereof, the production efficiency is high, the quality of the board is good, and the production cost is low.

Description

Technical field [0001] The invention relates to the technical field of circuit boards, in particular to a flexible and hard combined board and a method for grounding a window with a cover film. Background technique [0002] The conventional method of grounding the electromagnetic shielding film (EMI) of the inner layer of the flexible and rigid board is that the inner cover film is first opened and then attached to the inner flexible circuit board (FPC), and the inner flexible circuit board (FPC) is exposed The fenestration pad is connected to the electromagnetic shielding film grounding, thereby playing the role of grounding; however, the inner grounded fenestration PAD (the pad grounded to the electromagnetic shielding film) is exposed in the previous process, and the strong acid and alkali in the subsequent process Under the circumstances, the exposed inner layer of the previous process will be bitten by the open window PAD, so protective measures must be taken. [0003] The ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/36H05K3/46
Inventor 苏章泗刘振华王志强
Owner 台山市精诚达电路有限公司
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