Solder ring
A technology of solder rings and circular rings, applied in the field of solder rings, can solve problems affecting production efficiency, increasing labor costs, affecting product quality, etc., and achieve the effects of improving efficiency, increasing yield, and good welding quality
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Embodiment 1
[0016] The solder ring of the present invention comprises two solder ring main bodies 1, each solder ring main body 1 is circular, the two solder ring main bodies 1 are coaxially arranged in parallel, and the two solder ring main bodies 1 are connected by a plurality of connecting columns 2. A plurality of connecting posts 2 are vertically connected between two solder ring main bodies 1, and the number of connecting posts 2 may be 4-6. The connecting column 2 is vertically connected between two adjacent solder ring main bodies 1, and the structure is stable.
Embodiment 2
[0018] The solder ring of the present invention comprises two solder ring main bodies 1, each solder ring main body 1 is circular, the two solder ring main bodies 1 are coaxially arranged in parallel, and the two solder ring main bodies 1 are connected by a plurality of connecting columns 2. A plurality of connecting posts 2 are obliquely and rotatably connected between two solder ring main bodies 1, and the number of connecting posts 2 may be 3-5. The connection post 2 is connected between the two solder ring main bodies 1 with an oblique rotation, so that the melting connection of the solder is more uniform.
Embodiment 3
[0020] The solder ring of the present invention comprises two solder ring main bodies 1, each solder ring main body 1 is circular, the two solder ring main bodies 1 are coaxially arranged in parallel, and a helical ring is connected between the two solder ring main bodies 1. Connecting column 2. A helical connecting column is connected between the two solder ring bodies, and the melting and welding of the solder is more uniform, and has certain toughness and is not easy to deform.
[0021] The solder ring of the present invention uses a plurality of solder ring bodies arranged in parallel on the same axis, and a connecting column is arranged between the plurality of solder ring bodies to form the entire solder ring. The structure of the entire solder ring is stable. The area is large, the solder is large, and the guiding performance is good, so it is not easy to cause missing soldering or uneven soldering.
[0022] The solder ring of the present invention changes the structur...
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