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Server and its cooling components

A technology for cooling components and servers, applied in the field of servers, can solve the problem of inability to dissipate heat from the central processing unit, and achieve the effect of saving energy and reducing noise

Inactive Publication Date: 2018-04-13
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above problems, the object of the present invention is to provide a server and its heat dissipation assembly, so as to improve the current problem of not being able to efficiently dissipate heat to central processing units of different temperatures

Method used

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  • Server and its cooling components
  • Server and its cooling components
  • Server and its cooling components

Examples

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Embodiment Construction

[0033] The structural principle and working principle of the present invention will be described in detail below in conjunction with the accompanying drawings:

[0034] Please refer to figure 1 , figure 2 , image 3 and Figure 4 . figure 1 It is a perspective view of the structure of a server according to an embodiment of the invention. figure 2 for figure 1 Exploded view. image 3 It is a perspective view of the structure of a heat dissipation component according to an embodiment of the present invention. Figure 4 It is a cross-sectional view of a heat dissipation assembly according to an embodiment of the invention.

[0035] The server 10 includes a motherboard 12, two central processing units 14 and a heat dissipation component 15. The two central processing units 14 are arranged on the main board 12. The two central processing units 14 are separated from each other by a distance.

[0036] The heat dissipation assembly 15 includes two heat dissipation modules 16. In this e...

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PUM

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Abstract

The invention relates to a server and a heat-radiating component thereof. The server comprises a motherboard, two central processing units and the heat-radiating component, wherein the two central processing units are arranged on the motherboard; the heat-radiating component comprises two heat-radiating modules; the two heat-radiating modules are respectively fit with two heat sources; each of the two heat-radiating modules comprises a joint part; the joint part is provided with a first extending plate and a second extending plate, the first extending plate of one of the two heat-radiating modules is fit with the second extending plate of the other heat-radiating module, and the second extending plate of the one of the two heat-radiating modules is fit with the first extending plate of the other heat-radiating module.

Description

Technical field [0001] The present invention relates to a server, in particular to a server having two heat dissipation modules that can be connected to each other. Background technique [0002] With the development of electronic technology, the server has become a widely used information processing system in the industry. Servers, as hardware, usually refer to computers that have high computing power and can be used by multiple users. The server usually includes a motherboard, a central processing unit (CPU), a power supply, and a hard disk. [0003] In a server with multiple CPUs, due to differences in system configuration, the location of different CPUs may affect its operating temperature, and the program loads of different CPUs are also different. Therefore, in this server, the temperature of one central processing unit is very high, while the temperature of the other central processing unit is very low, so that the heat dissipation system corresponding to the higher tempera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/20G06F2200/203
Inventor 张晋
Owner INVENTEC PUDONG TECH CORPOARTION
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