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Small-part dense-array splicing thin plate and punching lower mold structure

A technology for small parts and thin plates, applied in the field of dense array splicing thin plates of small parts and the structure of the lower die for punching, can solve the problems of waste of raw materials, low utilization rate, etc., and achieve the effects of low stamping cost, high utilization rate, and fewer stamping processes

Inactive Publication Date: 2015-05-06
SUZHOU ZZH INTPROP SERVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the stamping of thin plate small parts, the thin plate base material for the production of thin plate small part stamping parts is relatively large. Before stamping, it needs to be arranged in an array to make full use of the thin plate base material, reduce costs and avoid waste. Make CAM pattern data in it During the operation, the number of stamping parts of thin plate small parts is often tens to hundreds of pieces. In order to improve the stamping accuracy and stamping quality, the stamping dies are designed with narrow and wide plate sides. There are 4 die positioning holes on the edge of the plate to perform positioning. The utilization rate of the thin plate stamping array base material with the edge of the plate and the positioning holes of the die is low. Although it has been improved, there are still more raw materials. Waste phenomenon, and this kind of thin plate stamping needs secondary stamping. It is necessary to stamp the process positioning round hole and process positioning waist hole on the edge of the forming plate first, and then the stamping is used to form the thin plate small parts stamping parts

Method used

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  • Small-part dense-array splicing thin plate and punching lower mold structure
  • Small-part dense-array splicing thin plate and punching lower mold structure
  • Small-part dense-array splicing thin plate and punching lower mold structure

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Embodiment Construction

[0018] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0019] refer to figure 1 and figure 2 As shown, a small parts dense array splicing thin plate and its stamping lower die structure includes a small parts dense array splicing thin plate 1 and a stamping lower die 8, and the small parts dense array splicing thin plate 1 is provided with thin plate small parts stamping parts 2 and edge Corner surplus material 3, the stamping lower die 8 is provided with the upper left reference limit corner block 9, the upper right reference limit corner block 10 and the lower limit stopper 11, the left reference limit corner block 9, the upper right reference limit angle block The block 10 and the lower limit stop 11 wrap and position the peripheral edge of the spliced ​​thin plate 1 with a dense array of small parts.

[0020] Further, such as image 3 as shown, Conventional punched thin plate ...

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Abstract

The invention discloses a small-part dense-array splicing thin plate and punching lower mold structure, which comprises a small-part dense-array splicing thin plate and a punching lower mold, wherein the small-part dense-array splicing thin plate is provided with a thin-plate small-part punching element and leftove bits and pieces, the punching lower mold is provided with a left upper reference position limiting angle block, a right upper reference position limiting angle block and a lower position limiting stop block, and the left upper reference position limiting angle block, the right upper reference position limiting angle block and the lower position limiting stop block wrap and position the peripheral edges of the small-part dense-array splicing thin plate. The small-part dense-array splicing thin plate and punching lower mold structure has the advantages that process plate edges necessary for the ordinary array splicing thin plate do not exist, the punching process of a positioning reference hole is removed, the final product of the thin-plate small-part punching element is directly formed, the punching work procedures are few, the punching cost is low, the utilization rate of a punching thin plate substrate is high, and the economic benefit is obvious.

Description

technical field [0001] The invention relates to the field of stamping forming of thin plates, in particular to a spliced ​​thin plate with a dense array of small parts and a stamping lower die structure thereof. Background technique [0002] In the stamping of thin plate small parts, the thin plate base material for the production of thin plate small part stamping parts is relatively large. Before stamping, it needs to be arranged in an array to make full use of the thin plate base material, reduce costs and avoid waste. Make CAM pattern data in it During the operation, the number of stamping parts of thin plate small parts is often tens to hundreds of pieces in one stamping. There are 4 die positioning holes designed on the edge of the plate to perform positioning. The utilization rate of the thin plate stamping array base material with plate edges and die positioning holes is relatively low. Although it has been improved, there are still more raw materials. Waste phenomen...

Claims

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Application Information

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IPC IPC(8): B21D28/14B21D28/04
CPCB21D22/02B21D37/10
Inventor 陈巧云征建高征茂德
Owner SUZHOU ZZH INTPROP SERVICES