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Electronic system comprising stacked electronic devices provided with integrated-circuit chips

A technology of electronic devices and integrated circuits, applied in the field of microelectronics, can solve problems such as compromise of electronic systems

Active Publication Date: 2015-05-06
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there currently exists an unsatisfactory compromise between the desired performance of an electronic system and its size, especially in the field of portable devices such as mobile phones

Method used

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  • Electronic system comprising stacked electronic devices provided with integrated-circuit chips
  • Electronic system comprising stacked electronic devices provided with integrated-circuit chips
  • Electronic system comprising stacked electronic devices provided with integrated-circuit chips

Examples

Experimental program
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Embodiment Construction

[0027] Such as figure 1 As shown, the electronic system 1 includes a first electronic device 2 and a second electronic device 3 stacked on each other and at a certain distance from each other.

[0028] The electronic device 2 includes a substrate wafer 4 provided with an integrated electrical connection network 5, and the integrated electrical connection network 5 includes: an electrical connection pad 6a arranged on one surface 4a on its central portion and an electrical connection pad 6a arranged on its periphery. Part of the electrical connection pad 6b and the electrical connection pad 7 on the opposite surface 4b.

[0029] The electronic device 2 includes at least one integrated circuit chip 8 mounted on the substrate wafer 4 through an electrical connection element 9 on the surface 4a of the substrate wafer 4. The electrical connection element 9 is inserted into the electrical connection pad of the chip 8 and electrically connected The network 5 is electrically connected bet...

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PUM

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Abstract

An electronic system includes a first electronic device (with a first integrated-circuit chip) and a second electronic device (with a second integrated-circuit chip). The second electronic device is stacked above the first electronic device on a same side as the first integrated-circuit chip. Electrical connection elements located around the first integrated-circuit chip electrically connected to the second electronic device to the first electronic device. A metal plate configured for heat capture and transfer extends between the first and second electronic devices. The metal plate includes through-passages aligned to permit the electrical connection elements to pass at a distance.

Description

[0001] Priority claim [0002] This application claims priority for French Patent Application No. 1360584 filed on October 30, 2013, the disclosure of which is incorporated herein by reference. Technical field [0003] The invention relates to the field of microelectronics. Background technique [0004] It is well known to construct electronic systems including electronic devices stacked on each other and electrically connected to each other, and each electronic device includes at least one integrated circuit chip. [0005] The stacking of electronic devices especially has the advantages of improved electrical connection performance and reduced size. However, in some cases, some integrated circuit chips generate heat, and the generated heat will heat other integrated circuit chips and subsequently degrade the performance of other integrated circuit chips. This is especially the case when the first electronic device includes a processor chip that generates heat and the second electro...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/31
CPCH01L25/105H01L2225/1023H01L2225/1058H01L2225/1094H01L2224/16225H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73204H01L2224/73265H01L2924/15311H01L23/367H01L23/3675H01L23/49816H01L23/5389H01L2023/4056H01L2023/4062H01L2924/15173H01L2224/73253H01L2224/32245H01L2924/00014H01L2924/00012H01L25/0657H01L2924/00
Inventor J-M·里维埃N·马丁
Owner STMICROELECTRONICS SRL