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Exposure device and exposure method

A technology of exposure device and exposure method, which is applied in the direction of photolithography exposure device, microlithography exposure equipment, etc., can solve the problems of complex adjustment process, exposure device complexity, cost, slowness, etc., and achieve the effect of ensuring uniform distribution

Active Publication Date: 2016-10-19
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when adjusting the local curvature of the mask, the adjustment process is very complicated and slow due to the fine adjustment of the mask; when adding an optical path adjustment unit in the optical path of the exposure light, it will cause the exposure device Complexity and rising costs

Method used

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  • Exposure device and exposure method
  • Exposure device and exposure method

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Experimental program
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Embodiment Construction

[0034] In order for those skilled in the art to better understand the technical solution of the present invention, the exposure device and exposure method provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0035] figure 1 It is a schematic structural diagram of the exposure device provided in Embodiment 1 of the present invention, figure 2 for figure 1 The top view of the medium-exposure abutment, such as figure 1 and figure 2 As shown, the exposure device includes: a light source 4 and a carrying base 1, wherein the light source 4 is used to provide parallel exposure light, the carrying base 1 is used to carry the substrate 2 to be exposed, and the carrying base 1 includes: several carrying units 7. The substrate to be exposed 2 is divided into several adjustment areas 3 corresponding to the carrying unit 7 one by one, and the carrying unit 7 is provided with a temperature adjustment module 8, which is used ...

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PUM

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Abstract

The invention discloses an exposure device and an exposure method. The exposure device comprises a bearing base station, wherein the bearing base station is used for bearing a substrate to be exposed and comprises a plurality of bearing units; the substrate to be exposed is divided into a plurality of regulating areas which are in one-to-one correspondence with the bearing units; a temperature regulating module is arranged in each bearing unit and is used for regulating the temperature of the corresponding regulating area on the substrate to be exposed, so that the corresponding regulating area on the substrate to be exposed generates corresponding thermal expansion. According to the technical scheme of the invention, corresponding thermal expansion is generated in each regulating area on the substrate to be exposed by regulating the temperature of each regulating area on the substrate to be exposed, so as to regulate the light intensity of the upper surface of each regulating area; therefore, the uniform distribution of the light intensity on the upper surface of the substrate to be exposed can be effectively guaranteed.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an exposure device and an exposure method. Background technique [0002] In the manufacturing process of the display panel, the photolithography process is a very important process. The current photolithography process generally includes: coating photoresist, pre-baking, exposure, development and post-baking. Among them, the coating of photoresist is to apply photoresist on the substrate after film formation in the previous process; pre-baking is to preheat the photoresist and remove the moisture of the photoresist to increase the adhesion between the photoresist and the substrate. Focus; exposure is to use exposure light to irradiate the photoresist through the mask plate to sensitize the photoresist; development is to remove the photoresist from the photosensitive part through the developer to form the required pattern; post-baking is to sensitize the photoresist. The unexpo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 朱凤稚
Owner BOE TECH GRP CO LTD