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Substrate holding device, polishing device, polishing method and holding ring

A substrate holding and retaining ring technology, applied in the direction of grinding equipment, grinding machine tools, manufacturing tools, etc., can solve the problem of increased grinding rate at the edge

Active Publication Date: 2019-04-09
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even though the polishing conditions are the same as a plurality of wafers are carried out, the outer shape of the edge of the wafer may gradually change.
Specifically, as the number of wafers to be polished increases, the polishing rate at the edge increases

Method used

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  • Substrate holding device, polishing device, polishing method and holding ring
  • Substrate holding device, polishing device, polishing method and holding ring
  • Substrate holding device, polishing device, polishing method and holding ring

Examples

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Embodiment Construction

[0092] Embodiments of the present invention will be described below with reference to the accompanying drawings.

[0093] figure 1 It is a schematic view showing a polishing apparatus provided with a substrate holding device according to an embodiment of the present invention. like figure 1 As shown, the polishing device has: a top ring (substrate holding device) 1 that holds and rotates a wafer (substrate) W; a polishing table 3 that supports a polishing pad 2; A polishing liquid supply nozzle 5 on the pad 2 ; and a film thickness sensor 7 that acquires a film thickness signal that varies with the film thickness of the wafer W. The film thickness sensor 7 is provided in the polishing table 3, and acquires film thickness signals in a plurality of regions including the center of the wafer W every time the polishing table 3 rotates once. Examples of the film thickness sensor 7 include an optical sensor and an eddy current sensor.

[0094] The top ring 1 is configured such ...

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PUM

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Abstract

A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad, and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.

Description

technical field [0001] The present invention relates to a substrate holding device for holding a substrate such as a wafer, and more particularly to a substrate holding device for pressing the substrate onto a polishing member such as a polishing pad to polish the surface of the substrate. In addition, the present invention relates to a polishing device and a polishing method using such a substrate holding device. Furthermore, the present invention relates to a holding ring used for the above-mentioned substrate holding device. Background technique [0002] In the manufacturing process of a semiconductor device, a polishing apparatus is widely used to polish the surface of a wafer. This polishing apparatus has: the polishing table that has the polishing pad of polishing surface is supported; Be used for the substrate holding device called top ring or polishing head that wafer is held; And the polishing liquid that supplies polishing liquid to the polishing surface supply n...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/32B24B37/10B24B37/34H01L21/687
CPCB24B37/107B24B37/32B24B37/04H01L21/304H01L21/67092H01L21/683
Inventor 山木晓安田穗积并木计介锅谷治福岛诚富樫真吾
Owner EBARA CORP