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Flip-chip swing anti-edge forming die

A technology of anti-wrapping and forming molds, which is applied in the field of flip-chip swinging anti-wrapping molding dies, which can solve the problems of shell anti-wrapping, easy wrinkling of films, sheet strain, etc., to avoid uneven edge leakage, Avoiding sheet strain and improving the yield rate

Active Publication Date: 2017-01-18
江苏坤达电器装饰有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the increasing popularity of electronic products such as mobile phones, notebooks, digital cameras, and washing machines, the demand for the casings of the above-mentioned electronic products has also grown steadily. At present, the casings of the above-mentioned electronic products are all processed by injection molding. With continuous innovation in appearance, many shells have turned-up edges, which brings challenges to the film forming process, especially the film forming mold.
[0003] In the current anti-hemming technology, the punch is installed on the upper mold. For high-drop and large-arc products, when the forming die is processed, the large-arc edge usually tilts upward. The film is stretched. Due to the high drop, the film is easy to wrinkle during stretching, and the repeated stretching area is too large, resulting in discoloration caused by sheet stretching, uneven edge leakage of the sheets on both sides, and side edges of high-drop products. sheet strain and other situations

Method used

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  • Flip-chip swing anti-edge forming die
  • Flip-chip swing anti-edge forming die
  • Flip-chip swing anti-edge forming die

Examples

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Embodiment Construction

[0020] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings and embodiments. The following examples are only used to illustrate the technical solutions of the present invention more clearly, and cannot be used to limit the protection scope of the present invention.

[0021] like Figure 1-Figure 5 As shown in the figure, a flip-chip swinging reverse hemming molding die includes an upper die 1 and a lower die 2, the upper die 1 is fixedly provided with a pressing plate 3, and the pressing plate 3 comprises a horizontal plate arranged horizontally 2. An arc-shaped plate head arranged at one end of the horizontal plate, the horizontal plate is fixedly arranged with the upper mold 1, one end of the arc-shaped plate head is a free end, and the upper mold 1 is rotatably provided with a A swing drive block 7, the swing drive block 7 has an arc-shaped surface matching with the arc-shaped plate head, the lower mo...

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PUM

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Abstract

The invention discloses a flip-over type swinging reversed covering edge forming die. The flip-over type swinging reversed covering edge forming die comprises an upper die and a lower die, wherein a material pressing plate is fixedly arranged on the upper die, and comprises a horizontal plate which is horizontally arranged, and an arc-shaped plate end arranged at one end part of the horizontal plate; the horizontal plate and the upper die are arranged oppositely; one end of the arc-shaped plate end is a free end; the upper die is rotationally provided with a swinging driving block; the swinging driving block is provided with an arc-shaped surface matched with the arc-shaped plate end; the lower die is fixedly provided with a product die seat matched with the material pressing plate; the swinging driving block is provided with a guide inclined plane; the guide inclined plane is located on one opposite side of the arc-shaped surface; the lower die is fixedly provided with a driving block; the driving block is provided with a driving inclined plane matched with the guide inclined plane; and a positioning guide mechanism is arranged between the upper die and the lower die, so that a condition that a sheet material is stretched in a reversed covering edge forming process and the color is changed is avoided, and the yield of products is improved.

Description

technical field [0001] The invention relates to a flip-chip swinging reverse hemming forming die. Background technique [0002] With the increasing popularity of electronic products such as mobile phones, notebooks, digital cameras, washing machines, etc., the demand for the above-mentioned electronic product casings has also increased steadily. At present, the above-mentioned electronic product casings are all processed by injection molding. However, with the above-mentioned electronic product casings With the continuous innovation in appearance, many shells have reverse wrapping, which brings challenges to the film forming process, especially the film forming mold. [0003] In the current reverse hemming technology, the punch is mounted on the upper mold. For high drop and large arc products, when the forming mold is processed, the large arc edge is usually raised upwards. When the reverse hemming is performed, it is usually necessary to When the film is stretched, due to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C43/36B29C53/06B29C53/80
CPCB29C43/36B29C53/06B29C53/80B29C2043/3602
Inventor 张瑞坤
Owner 江苏坤达电器装饰有限公司