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Thin film packaging structure

A technology of thin-film packaging and thin-film layer, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of device damage, inability to completely block water vapor, and failure, so as to reduce thickness and weight and prevent water vapor Penetrating, reducing the effect of the number of layers

Active Publication Date: 2015-05-20
KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The main method for the industry to improve thin-film packaging technology is to use drying sheets or to increase the water-oxygen barrier capacity of the thin-film packaging layer as much as possible, such as depositing multiple layers of organic-inorganic composite films after the display device is fabricated to prolong the diffusion path of water and oxygen in the film. However, the technology still has inherent limitations
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Method used

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Examples

Experimental program
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Example Embodiment

[0019] Example one

[0020] Surface roughness refers to the small spacing (Ry) and small peak and valley unevenness (Rz) of the surface, which is proportional to the surface tension. Surface roughening treatment is a physical or chemical method performed on the surface of a material in order to form surface roughness, such as a plasma treatment method.

[0021] Such as figure 1 As shown, a packaged device 101 is arranged on a substrate 100, and a first-level thin film layer 102, which is parylene, is deposited on top of the packaged device 101, and is plasma treated with argon in the dry etching chamber . A second-level thin-film layer 103, which is aluminum oxide, is deposited on the first-level thin-film layer 102, and is plasma treated with argon in the dry etching chamber. A third-level thin-film layer 104, which is parylene, is deposited on the second-level thin-film layer 103, and is plasma treated with argon in the dry etching chamber.

[0022] In the above-mentioned roughe...

Example Embodiment

[0025] Example two

[0026] Chemical modification refers to the process of replacing a certain hydrophilic gene of the matrix material with a hydrophobic group by adsorption, coating, polymerization, chemical reaction and other methods to improve the hydrophobic properties of the material, such as fluorination or silicification. The concentration of surface chemical modification (such as fluorine concentration after fluorination or silicon concentration after silicification) is inversely proportional to surface tension.

[0027] Such as figure 2 As shown, a packaged device 201 is arranged on a substrate 200, and a first-level thin film layer 202, which is parylene, is deposited on top of the packaged device 201, and is fluorinated with CF4 gas in the dry etching chamber deal with. A second-level thin-film layer 203 is deposited on the first-level thin-film layer 202, which is aluminum oxide, and is fluorinated in the dry etching chamber using CF4 gas. A third-level thin-film lay...

Example Embodiment

[0031] Example three

[0032] Such as image 3 As shown, a packaged device 301 is arranged on a substrate 300, and a first-level thin film layer 302 is deposited on the packaged device 301, which is graphene, and has a thermal conductivity of 5300 W / mK. A second-level thin-film layer 303 is deposited on the first-level thin-film layer 302, which is aluminum oxide and has a thermal conductivity of 45 W / mK. A third-level thin-film layer 304 is deposited on the second-level thin-film layer 303, which is silicon oxide and has a thermal conductivity of 7.6 W / mK.

[0033] By formula (among them Is the surface tension coefficient, Is the molar volume, Is a universal constant, Is the critical temperature when the surface tension is reduced to 0, and T is the temperature). It can be seen that temperature is inversely proportional to surface tension. Therefore, the film encapsulation structure will form a surface tension gradient that gradually increases from the E end to the F end, an...

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Abstract

The invention provides a thin film packaging structure, aiming to lower the impact of moisture, absorbed on the surface of multi-layer packaging thin films or permeating into the multi-layer packaging thin films, on a packaged device. The thin film packaging structure comprises multi-layer thin film layers arranged on one side of the packaged device. Surface tensions of the think film packaging structure increase gradually from inside to outside. Further, the thin film packaging structure is provided with N thin film layers including a first thin film layer, a second thin film layer ... and an N thin film layer from inside to outside, and N is not smaller than 2, and surface strengths of the thin film layers increase gradually from the first thin film layer to the N thin film layer. The thin film packaging structure is capable of restraining moisture permeation and prolonging service life of the device.

Description

technical field [0001] The invention relates to a thin film packaging structure, in particular to a thin film packaging structure of a flexible organic light emitting diode. Background technique [0002] Thin-film packaging technology is especially suitable for some special occasions that cannot be realized by traditional capping packaging, such as the packaging of flexible organic light-emitting diodes (OLEDs) and flexible organic solar cells. The main method for the industry to improve thin-film packaging technology is to use drying sheets or to increase the water-oxygen barrier capacity of the thin-film packaging layer as much as possible, such as depositing multiple layers of organic-inorganic composite films after the display device is fabricated to prolong the diffusion path of water and oxygen in the film. However, the technology still has inherent limitations. Because even alternately deposited multilayer films cannot guarantee that there are no pinholes at all, and...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/26H01L23/29H01L51/52
Inventor 习王锋陈红蔡世星
Owner KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT
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