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Solder paste supply device

A technology for solder paste and connecting parts, which is applied in tin feeding devices, welding equipment, printed circuits assembled with electric components, etc. It can solve the problems of solder paste waste, separation of solder particles and liquid flux, etc.

Inactive Publication Date: 2015-05-20
李同周
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the conventional apparatus for supplying solder paste has a problem that the solder particles of the solder paste 1 and the liquid flux are separated inside the chamber 11 after a predetermined period of time elapses.
The solder paste is wasted since the solder paste 1 filling the chamber 11 is discarded after the process is complete

Method used

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Examples

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Embodiment Construction

[0024] Hereinafter, embodiments of an apparatus for supplying solder paste according to the present invention will be described with reference to the accompanying drawings.

[0025] figure 2 To show a view of an apparatus for supplying solder paste according to a first embodiment of the present invention, image 3 for illustration figure 2 A view of the operating principle of the device for supplying solder paste in, and Figure 4 for illustration figure 2 A view of the operating status of the device for supplying solder paste in .

[0026] refer to Figure 2 to Figure 4 , the device 100 for supplying solder paste according to the first embodiment of the present invention includes a first chamber 110, a second chamber 120, a bottle neck connection 130, a first booster 140, a second booster 150, a nozzle 160, closing plate 171, closing driver 172, sensor 180, storage 190, blade 101, and vertical driver, wherein the device 100 for supplying solder paste according to the ...

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Abstract

The present invention relates to a solder paste supply device, comprising: a first chamber; a second chamber; a bottle-neck connection part; a first press part; a second press part; and a nozzle part. The first chamber receives solder paste therein and has a first sectional surface intersecting the movement direction of the solder paste. The second chamber receives the solder paste therein and has a second sectional surface intersecting the movement direction of the solder paste. The bottle-neck connection part has a third sectional surface intersecting the movement direction of the solder paste and is smaller than the first sectional surface and the second sectional surface, and connects the first chamber and the second chamber. The first press part applies pressure to the solder paste which is received in the first chamber so as to move the solder paste towards the second chamber side through the bottle-neck connection part. The second press part applies pressure to the solder paste which is received in the second chamber so as to move the solder paste towards the first chamber side through the bottle-neck connection part. The nozzle part is provided to the bottle-neck connection part and sprays the solder paste which passes through the bottle-neck connection part to the outside.

Description

technical field [0001] The present invention relates to a device for supplying solder paste, and more particularly to a device for supplying solder paste that is mounted to a screen printing machine and supplies solder paste to mask to enable the mounting of various chips to the printed circuit board. Background technique [0002] Generally, molten solder paste is applied to have a certain pattern on a printed circuit board (PCB) to be mounted as a main part of electronic devices such as computers, home appliances, etc., so that small semiconductor chips, resistor chips, etc. Electronic parts are mounted to the printed circuit board. This process of applying solder paste is performed by a device for applying solder paste called a screen printer. The screen printer applies solder paste to the component mounting portion of the printed circuit board in such a manner that the solder paste is squeezed through the opening by the extruder to be supplied onto the metal mask, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34B23K3/06
CPCB23K3/0638H05K3/1233H05K2203/0126H05K3/3485B23K3/06H05K3/34
Inventor 李同周
Owner 李同周
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