1results about How to "Defect rate minimization" patented technology

This invention discloses a wafer release method for use in a wafer processing system and a wafer processing method. The wafer release method of this invention includes: a polarity reversal step of reversing the polarity of a voltage applied to a chuck; a first transfer step of raising a lifting pin housed in the chuck at a first transfer speed to transfer a wafer supported on the chuck to a first predetermined position; and a second transfer step of raising the lifting pin at a second transfer speed different from the first transfer speed to transfer the wafer positioned at the first predetermined position to a second predetermined position higher than the first predetermined position.