4results about How to "Defect rate minimization" patented technology

This invention discloses a wafer release method for use in a wafer processing system and a wafer processing method. The wafer release method of this invention includes: a polarity reversal step of reversing the polarity of a voltage applied to a chuck; a first transfer step of raising a lifting pin housed in the chuck at a first transfer speed to transfer a wafer supported on the chuck to a first predetermined position; and a second transfer step of raising the lifting pin at a second transfer speed different from the first transfer speed to transfer the wafer positioned at the first predetermined position to a second predetermined position higher than the first predetermined position.

Provided is a coil device in which the thickness of a conductor pattern can be increased while minimizing a reject ratio. The coil device includes: a base material; the seed crystal pattern is formed on the base material and comprises a seed crystal area and an inlet wire area; a first conductive pattern formed on the seed region; a second conductive pattern formed on at least a portion of the first conductive pattern; and a protective layer formed so as to be in contact with at least one of the substrate, the seed pattern, the first conductive pattern, and the second conductive pattern. Wherein the seed crystal pattern in the wire inlet and guide area extends to the cutting wire.

A mask assembly for manufacturing a display device and an apparatus for manufacturing a display device including the mask assembly are provided, wherein the mask assembly includes: a mask frame including a pair of first side portions arranged along a first direction, a pair of second side portions arranged along a second direction intersecting the first direction, and an opening portion defined by the first side portions and the second side portions; a mask sheet arranged on the opening portion of the mask frame, fixed on the mask frame, and including a plurality of openings; and a supporting member attached to at least one of the first side portion and the second side portion of the mask frame by means of an applied tensile force.

Provided are an apparatus and a method for monitoring a substrate to determine a state of a processed substrate and check whether there is an abnormality in the processed substrate. The apparatus for inspecting a substrate includes a substrate mounting portion that moves with respect to a substrate and is for mounting the substrate, a measuring portion for monitoring the substrate, a control portion configured to control a movement path of the measuring portion such that at least some areas are monitored from different positions with respect to a plurality of substrates, and an analysis portion, and an abnormality determination unit configured to determine the presence of an abnormality from monitoring information about the plurality of substrates.