Substrate cutting method
A cutting method and substrate technology, applied to clay products, other household appliances, household appliances, etc., can solve the problems of scratches, glass substrates prone to chipping or bright edges, and capacitive touch screen disconnection, etc., to improve the yield, Reduce the effect of chipping
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[0025] In order to illustrate a substrate cutting method provided by the present invention, a detailed description will be given below with reference to the drawings and text description of the specification.
[0026] Please also refer to figure 1 , Which is a schematic diagram of a substrate 100 before cutting according to a preferred embodiment provided by the present invention. The substrate 100 includes at least a first surface 101. In this embodiment, the first surface 101 is a flat surface. In other embodiments, the first surface 101 may also be a curved surface or an irregular surface.
[0027] The first surface 101 includes at least a plurality of first regions 111 for forming a plurality of panel units 10, a plurality of first film layers 11 are formed on the first surface 101, and a plurality of first film layers 11 Covering at least a plurality of the first regions 111, a plurality of the first film layers 11 are arranged at regular intervals, and are located on the same...
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