A bonding device and bonding method for inclined butt joints

A technology for butt joints and bonding, which is applied in the direction of connecting components, material gluing, mechanical equipment, etc., can solve the problems of difficulty in precise control of the thickness of the adhesive layer, cannot be relatively far away, and it is difficult to accurately control the thickness of the adhesive layer, etc., to reduce bonding The risk of failure, the effect of saving investment and reducing the probability of scrap
CN104675816BInactive Publication Date: 2016-11-02JILIN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JILIN UNIV
Publication Date
2016-11-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a bonding device for a slope butt joint. The bonding device comprises a base, fixed pressing bars, a top block, a position measuring mechanism, a driving mechanism and a controller, wherein a V-shaped positioning groove is formed in the base; the fixed pressing bars are fixed on two sides of the V-shaped positioning groove of the base through screws; the top block is in contact with the non-bonding end of a second joint and pushes the second joint to approach to a first joint; the position measuring mechanism is used for measuring the position of the top block; the controller is used for controlling the driving mechanism to operate and drive the top block to move, so the space between the first joint and the second joint reaches the target distance. According to the bonding device disclosed by the invention, better generality is realized, and the bonding of slope butt joints with different angles can be realized; the driving mechanism has two different driving ratios, so the top block can be driven to move at different speeds; when the top block is close to the target distance, the top block is enabled to slowly move, the accurate target distance is reached, the non-retracement bonding is realized, the risk of bonding failure is reduced, and the probability that waste pieces are generated is reduced.
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Description

technical field

[0001] The invention relates to the technical field of bonding fixtures, in particular to a bonding device and a bonding method that can precisely control the thickness of the adhesive layer of a test piece bonded to a variety of inclined joints with different angles. Background technique

[0002] Compared with traditional methods such as riveting, welding, and screwing, the bonding technology has a wide range of applications and is less affected by the type of material and the geometry of the bonding parts; the ratio of strength to mass is high, which is conducive to lightweight; shock absorption and Good impact resistance and other advantages have been used more and more in today's industrial production. According to the existing research, the connection strength of the adhesive sample is closely related to the thickness of the glue layer, so the control of the thickness of the glue layer is especially important for the application of the bonding technology...

Claims

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