Water cooling heat dissipation device

Abstract

The invention discloses a water cooling heat dissipation device. The water cooling heat dissipation device comprises a heat dissipation main body and a plurality of heat dissipation columns or fins, wherein the heat dissipation main body comprises a base and a cover plate which are buckled with each other; the plurality of heat dissipation columns or fins are welded together with the base and the cover plate completely; the base is provided with a water inlet, a water outlet and an accommodating cavity communicated with the water inlet and the water outlet; the plurality of water dissipation columns are arranged in the accommodating cavity; integral vacuum brazing seal is adopted for the base and the cover plate; the plurality of heat dissipation columns are uniformly distributed on the base and are of an integral molding structure with the base via a cold forging or warm forging technology, wherein the technology belongs to cold forging or warm forging at the temperature of -10 DEG C-450 DEG C. According to the water cooling heat dissipation device, the heat dissipation columns, the base and the cover plate are completely welded together, so that the seal effect of the water cooling heat dissipation device is reinforced, the service life is prolonged, and the heat dissipation and cooling effects are good; the cooling effect can be close to that of a pure-copper water cooling heat dissipation device, and the cost is reduced by about 40% compared with that of the pure-copper water cooling dissipation device. The water cooling heat dissipation device is high in use intensity, and is good in reliability and safety.

Description

technical field [0001] The invention relates to a heat dissipation technology and device, in particular to a water-cooled radiator. Background technique [0002] The current electronics industry is developing rapidly, and many electronic devices will involve heat dissipation problems. To dissipate heat from electronic devices, radiators must be used. However, the existing water-cooled radiators generally adopt the form of sealing rings or Friction stir welding or electron beam (laser) welding is used for sealing. The sealing ring is easy to age in a long-term operating environment and the sealing performance is weakened, which affects the service life of the water-cooled radiator. Friction stir welding or electron beam (laser) welding can only Weld the cover plate and the base for one week, and the heat dissipation column or fins cannot be completely combined with the inner bottom of the base through welding, so that batch reflow soldering will make the electronic components...

AI Technical Summary

Problems solved by technology

[0002] The current electronics industry is developing rapidly, and many electronic devices will involve heat dissipation problems. To dissipate heat from electronic devices, radiators must be used. However, the existing water-cooled radiators generally adopt the form of sealing rings or Friction stir welding or electron beam (laser) welding is used for sealing. The sealing ring is easy to age in a long-term operating environment and the sealing performance is weakened, which affects the service life of the water-cooled radiator. Friction stir welding or electron beam (laser) welding can only Weld the cover plate and the base for one week, and the heat dissipation column or fins cannot be completely combined with the inner bottom of the base through welding, so that batch reflow soldering will make the electronic components cannot be heated well when they reach the cover plate of the water cooling box or the outer surface of the base. surface, so that it is impossible to find out the weak soldering or desoldering, so there are serious quality risks; secondly, the current water-cooled radiators are not solid and stable, which leads to the reduction of the heat dissipation effect of the water-cooled radiators

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