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Laminating equipment

A technology for laminating equipment and mounting boards, which is applied in layered products, lamination devices, laminations, etc., and can solve problems such as the thickness of the lamination does not meet the predetermined requirements, the cracking of the lamination substrate, and the yellowing.

Active Publication Date: 2015-06-10
SHENZHEN LIANDE AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, no matter whether solid OCA glue or liquid water glue is used, there is currently no lamination equipment that can control the lamination pressure very accurately, resulting in yellowing, glue overflow, and lamination thickness of up to Less than the predetermined requirements, or even the cracking of the bonding substrate, etc., have a great relationship with the control and maintenance of the bonding pressure

Method used

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Embodiment Construction

[0031] The up and down described in the present invention are based on the position of the laminating equipment in the drawings, which does not limit the protection scope of the present invention.

[0032] see Figure 1~2 . The bonding equipment includes a frame 1 (not shown), a bonding mechanism 2 and a lifting mechanism 3 .

[0033] Specifically, the frame 1 carries the bonding mechanism 2 and the lifting mechanism 3 .

[0034] The bonding mechanism 2 includes a first cavity 21 and a second cavity 22, the first cavity 21 and the second cavity 22 are set up and down, and the first cavity 21 can be on the top and the second cavity 22 can be on the bottom, or it can be The first cavity 21 is on the bottom and the second cavity 22 is on the top. The first cavity 21 is close to the second cavity 22 , the templates installed on the two cavities 11 are relatively attached, and the relative movement between the first cavity 21 and the second cavity 22 is controlled by the lifting...

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Abstract

The invention discloses laminating equipment. The laminating equipment comprises a rack as well as a laminating mechanism and a lifting mechanism which are arranged on the rack, wherein the laminating mechanism comprises a first cavity and a second cavity which are formed up and down; the lifting mechanism is used for controlling the first cavity and the second cavity to be integrated; a buffer mechanism is arranged on the laminating mechanism. According to the laminating equipment disclosed by the invention, main power for laminating is provided by the first cavity, and counter-acting force is provided by the second cavity; in a laminating process, the first cavity is continuously drawn close; when the pressure reaches required pressure, a pressure holding mechanism starts to work, and is shortened to form continuous pressure holding; the buffer mechanism can be used for preventing rigid collision between the first cavity and the second cavity, so that the equipment structure is prevented from being damaged.

Description

technical field [0001] The invention relates to a bonding device, in particular to a vacuum bonding device. Background technique [0002] The bonding device is a crucial device in the smart display device. It mainly bonds the three major components used in the smart display, the protective layer, the sensing layer and the display layer. At present, the bonding media for bonding the three together are mainly solid OCA glue and liquid water glue. However, no matter whether solid OCA glue or liquid water glue is used, there is currently no lamination equipment that can control the lamination pressure very accurately, resulting in yellowing, glue overflow, and lamination thickness of up to 100% due to uneven pressure control during the lamination process. Failure to meet the predetermined requirements, or even the cracking of the bonding substrate, has a great relationship with the control and maintenance of the bonding pressure. In particular, it is a trend that the current p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10
CPCB32B37/10
Inventor 杨林肖云湖陈滔
Owner SHENZHEN LIANDE AUTOMATION EQUIP
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