Method for producing an optoelectronic assembly, and optoelectronic assembly

Abstract

The invention relates to a method for producing an optoelectronic assembly in various embodiment examples. The optoelectronic assembly has a first optoelectronic component and at least one second optoelectronic component, which is connected in series with the first optoelectronic component. In the method, a substrate (10) is provided. A first electrically conductive layer (12) is formed on the substrate (10). A second electrically conductive layer (14) is formed on the first electrically conductive layer (12). An insulator material is applied to the second electrically conductive layer (14) and the substrate (10), the insulator material being structured in such a way that the following are formed by the insulator material: at least one first insulator region (28), which electrically insulates a first component region (16) for arranging the first optoelectronic component from a second component region (18) for arranging the second optoelectronic component, a second insulator region (30), which electrically insulates the second component region (18) from a first contact region (36), a third insulator region (32), which is arranged on a side of the first component region (16) facing away from the first insulator region (28), and a fourth insulator region (34), which is arranged between the first and the second insulator region (28, 30) on a side of the second component region (18) facing away from the second insulator region (30), wherein a third contact region (46) is formed between the first insulator region (28) and the fourth insulator region (34). A first optically functional layer (52) is formed in the first component region (16) and a second optically functional layer (54) is formed in the second component region (18). An electrically conductive electrode layer is applied to the optically functional layers (52, 54) and the first and the third contact region (36, 46), the electrode layer being structured in such a way that the first optically functional layer (52) is electrically coupled to the third contact region (46) and the second optically functional layer (54) is electrically coupled to the first contact region (36).

Description

technical field [0001] The invention relates to a method for producing an optoelectronic component and an optoelectronic component. Background technique [0002] In optoelectronic components, such as organic light-emitting diodes, the insulator is also used to separate two electrode regions from one another and / or to electrically insulate them from one another. [0003] Suitable insulators, such as photosensitive varnishes, usually have to be applied very expensively and in a complex manner, for example in photolithographic processes. The varnish is usually applied planarly without structures to the metal layer to be etched subsequently and exposed by means of a mask. Depending on the varnish used, the exposed or unexposed regions can then be removed, thereby structuring the varnish layer. The remaining lacquer structure protects the underlying metal layer or layers in the subsequent etching process. Contents of the invention [0004] In various embodiments, a method fo...

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Problems solved by technology

[0003] Appropriate insulators, such as photosensitive varnishes, are often very expensive and expensive to apply, for example in photolithographic processes

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