A double air flotation large substrate transfer device
A transmission device and air flotation technology, which is applied in the field of double air flotation large-scale substrate transmission device, can solve the problems of low efficiency, long exposure waiting time, and improve the transmission efficiency of large substrates, so as to ensure the exposure quality and shorten the lower plate and upper plate Time interval, the effect of improving productivity
Active Publication Date: 2018-03-02
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
With the rapid development of the integrated circuit manufacturing industry, the substrates to be transferred are getting larger and larger, and it is necessary to efficiently transfer large substrates to improve productivity. Only one single-layer transfer station is set before exposure, which makes exposure waiting time long and low in efficiency.
However, the existing technology cannot improve the transfer efficiency of large substrates by reducing the loading time
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0014] A specific embodiment of the present invention will be described in detail below with reference to the accompanying drawings, which is a double-air-floating large-scale substrate transfer device for lithography equipment. However, the present invention should be understood as not limited to such embodiments described below, and the technical idea of the present invention can be implemented in combination with other known technologies or other technologies having the same functions as those known technologies.
[0015] In the following description, in order to clearly show the structure and working method of the present invention, many directional words will be used to describe, but "front", "rear", "left", "right", "outer", "inner" should be used Words such as ", "outward", "inward", "upper" and "lower" are to be understood as convenient terms, and should not be understood as restrictive terms. In addition, the term "X direction" used in the following description main...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a double air flotation large-scale substrate transmission device, which includes: an air flotation frame, the air flotation frame is located on a frame, and can move up and down relative to the frame, and the air flotation frame is provided with the same structure The first air flotation unit and the second air flotation unit, the first air flotation unit is located vertically above the second air flotation unit, and the first and second air flotation units respectively include The air buoyancy block, and the vertical transmission module located on the air buoyancy block.
Description
technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a double-air-floating large-scale substrate transmission device. Background technique [0002] In many semiconductor equipment such as lithography machines, the substrate needs to pass through the transfer station for handover when it is transferred into the exposure station. In the prior art, a transfer station is generally set before exposure, and the substrate is transferred to the exposure position. With the rapid development of the integrated circuit manufacturing industry, the substrates to be transferred are getting larger and larger. It is necessary to efficiently transfer large substrates to improve productivity. Only one single-layer transfer station is set before exposure, which makes the exposure waiting time long and low in efficiency. . However, the prior art cannot improve the transfer efficiency of large substrates by reducing the loadin...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 吴福龙周畅阮冬
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD