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Electronic device

A technology for electronic equipment and heat dissipation pipes, applied in the field of machinery, can solve the problems of slow heat speed and speed up heat dissipation, and achieve the effect of improving heat dissipation speed and speeding up heat dissipation

Inactive Publication Date: 2015-07-01
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present application provides an electronic device, which is used to solve the technical problem of the slow heat conduction speed of the alloy entity in the prior art, and realizes the technical effect of transferring heat through the heat dissipation fluid, thereby accelerating the heat dissipation

Method used

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Embodiment Construction

[0037] The present application provides an electronic device, which is used to solve the technical problem of slow heat conduction of functional components in the prior art, and realizes the technical effect of transferring heat through a heat dissipation fluid, thereby accelerating heat dissipation.

[0038] In order to solve the technical problem of slow heat dissipation in the prior art, the general idea of ​​the technical solution provided by this application is as follows:

[0039] In the technical solution of the present application, the electronic equipment includes a housing and functional components in the inner space of the fuselage; the housing includes a heat dissipation pipe connected to the functional components, the heat dissipation pipe is filled with heat dissipation fluid, and the heat dissipation The fluid circulates in the heat dissipation pipe; the functional components generate heat when they are in operation, and the heat is conducted through the heat dis...

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Abstract

The invention provides an electronic device and aims to solve the technical problem that the prior alloy entity dissipates heat of a functional component at low speed, achieve heat transmission by cooling fluid and higher heat dissipating speed. The electronic device comprises a housing and a functional component disposed within space of the housing; the housing comprises a cooling pipe connected with the functional component; the cooling pipe is filled with cooling fluid; the cooling fluid circularly lows in the heating pipe; when the functional component operates and produces heat, the cooling pipe and the cooling fluid transfer the heat.

Description

technical field [0001] The invention relates to the field of mechanical technology, in particular to an electronic device. Background technique [0002] With the continuous development of science and technology, electronic technology has also developed rapidly, and there are more and more types of electronic products, and people have also enjoyed various conveniences brought by the development of science and technology. Now people can enjoy the comfortable life brought by the development of science and technology through various types of electronic devices. [0003] Functional components in electronic equipment emit heat when they are in working condition, such as central processing unit, chip, memory, memory, interface, etc. As users' requirements for functions and performance of electronic equipment increase, the number of functional components and the energy consumption of each functional component increase, resulting in an increase in the heat generated inside the elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 吕开金
Owner LENOVO (BEIJING) LTD
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