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Camera module

A technology of camera module and lens module, which is applied in the field of camera, can solve problems such as rubber needles colliding with electronic components, debris is difficult to eliminate, and image quality is affected, so as to improve flatness, reduce overall height, and improve image quality. Effect

Inactive Publication Date: 2015-07-08
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When drawing glue on the production line, there is a risk that the glue needle will hit the electronic components. Once it hits the electronic components, a lot of debris will be generated. This kind of debris is difficult to remove and will affect the image quality in severe cases.

Method used

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Embodiment Construction

[0026] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0027] The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same...

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Abstract

A camera module comprises a flexible circuit board, a ceramic substrate, an electronic component, an image sensor, a light filter and a lens module. A first groove is formed in the middle of the surface, deviating from the flexible circuit board, of the ceramic substrate, a second groove is formed in the bottom of the first groove, and a through hole or a third groove is formed in the bottom of the second groove. The electronic component is accommodated in the through hole or the third groove, and glue application is conducted on the surface, deviating from the surface of the flexible circuit board, of the ceramic substrate, so that the electronic component is prevented from being bumped by a plastic pin during glue application on production line, chipping production is effectively avoided, and the imaging quality of the camera module is improved.

Description

technical field [0001] The invention relates to the technical field of cameras, in particular to a camera module. Background technique [0002] In recent years, with the development of multimedia technology, the application range of camera modules has become wider and wider, and has been widely used in electronic products such as mobile phones, computers, and miniature cameras. [0003] A camera module usually includes a lens module, a base, an infrared cut filter, an image sensor (sensor), electronic components, and a circuit board. The electronic components generally include capacitors and resistors, which mainly serve as auxiliary supplementary voltages. In the traditional camera module structure, the image sensor and electronic components are placed on the circuit board and accommodated in the inner cavity of the base. When the size of the image sensor is large, the space for placing the electronic components is small, so the electronic components are placed close to th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
Inventor 于立新刘磊
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD