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Sapphire and its processing method

A processing method, sapphire technology, applied in stone processing equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of inability to obtain material utilization, increase material cost, and low product market acceptance

Active Publication Date: 2017-07-25
CHONGQING SILIAN OPTOELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, more existing product designs require small discs with a diameter of more than 10mm or small squares with a side length of more than 10mm. If the 2-inch disc is used for processing, the best material utilization rate cannot be obtained, and the Significantly increase the cost of materials, so that the product market acceptance is low

Method used

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  • Sapphire and its processing method
  • Sapphire and its processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Place the grown sapphire crystal on the fixed tooling, use diamond wire for multi-wire cutting (usually 3 multi-wire cutting machines), and cut the crystal into blocks (cube-shaped squares), the section of the block is 55X55mm The square length is the length actually cut from the crystal.

[0019] The sapphire square is processed into a 55X55mm thin square by the method of intensive multi-line cutting, and the thickness can be 0.6mm or 0.7mm according to the thickness of the final product.

[0020] The square piece is ground to remove the cutting line marks; after cleaning, the square piece is annealed and annealed at a temperature of 1400 degrees Celsius in an annealing furnace; , to complete 55X55mm square, the thickness can be 0.3mm, or 0.4mm

[0021] The double-sided polished square sheet is cut into small pieces (windows), which can be cut with an ultra-fast laser. Ultrafast is defined as a light pulse with a time width of less than nanoseconds (10 -9 second). ...

Embodiment 2

[0026] The method of Example 1 is used for cutting, and the cross-section of the sapphire crystal is a square with different side lengths and a square substrate is made, and the small window is further intercepted as required, and is compared with the intercepted quantity of a standard 2-inch sapphire disc. :

[0027] From a 2-inch wafer, a square wafer with a side length of 10mm and a wafer with a diameter of 10mm can take 12 and 14 wafers respectively;

[0028] From a 55X55mm square piece, a square piece with a side length of 10mm and a circular piece with a diameter of 10mm can take 25 pieces and 25 pieces respectively.

[0029] From a 2-inch circular piece, a square piece with a side length of 11mm and a circular piece with a diameter of 11mm can take 9 pieces and 12 pieces respectively;

[0030] From a 60X60mm square piece, a square piece with a side length of 11mm and a circular piece with a diameter of 11mm can take 25 pieces and 25 pieces respectively.

[0031] From ...

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Abstract

Disclosed is a sapphire processing method, comprising cutting a sapphire crystal into a cuboid-shaped block, wherein at least the upper and lower bottom surfaces of the cuboid-shaped block are in the shape of a square, and the side lengths of the block are between 50-60 mm; then, cutting the block into several square substrates having the same or different thicknesses, wherein the side lengths of the upper and lower bottom surfaces of the substrate are equal to that of the upper and lower bottom surfaces of the block; and then cutting the square substrates into several diaphragms, the diaphragms having square or round upper and lower bottom surfaces thereof, and wherein the thicknesses thereof are equal to that of the substrates, and the side lengths of the bottom surface of the square substrate being 4-5 times of the length of the side lengths or diameter of the bottom surface of the diaphragm, plus a 1-5 mm machining allowance. The sapphire processing method provided in the present invention can effectively improve the utilization ratio of sapphire materials in order to minimize the usage-cost of sapphire diaphragms, and can be widely used in the production of sapphire diaphragms.

Description

technical field [0001] The application of the present invention belongs to the field of sapphire processing, and in particular relates to a sapphire product, a processing method thereof, and use in preparing a sapphire window sheet. Background technique [0002] Sapphire (Sapphire) is a general term for corundum gemstones other than red rubies in corundum gemstones, and its main component is aluminum oxide (Al 2 O 3 ), which is composed of three oxygen atoms and two aluminum atoms combined in the form of covalent bonds, and its crystal structure is a hexagonal lattice structure. Due to the wide optical penetration band of sapphire, sapphire has good light transmittance from near-ultraviolet (190nm) to mid-infrared, so it is widely used in optical components, infrared devices, high-intensity laser lens materials and mask materials. , with high speed of sound, high temperature resistance, corrosion resistance, high hardness, high light transmittance and so on. Sapphire is e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B24B7/22B23K26/38B23K26/402
CPCB28D5/04
Inventor 冯明明
Owner CHONGQING SILIAN OPTOELECTRONICS SCI & TECH