Infrared detector packaging assembly and infrared detector with same
A technology for infrared detectors and packaging components, which is applied in the field of infrared detectors and can solve problems such as cracking, low compressive strength, and thermal mismatch.
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[0030] In order to further explain the technical means and functions adopted by the present invention to achieve the intended purpose, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.
[0031] Such as figure 1 As shown, the infrared detector package assembly 100 according to the embodiment of the present invention includes: a housing assembly, a chip 20 and a lead ring 40 .
[0032] Wherein, the casing component defines a cavity S0, and the chip 20 is disposed in the cavity S0. The frame of the lead ring 40 constitutes an integral part of the housing assembly, that is, the frame portion of the lead ring 40 constitutes an integral part of the housing assembly, and jointly defines the chamber S0. The chip 20 is electrically connected to the lead ring 40 to electrically lead the chip 20 out of the chamber S0. Thus, the chip 20 can be connected to components outside the chamber S0 through the lead ri...
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