Infrared detector packaging assembly and infrared detector with same

A technology for infrared detectors and packaging components, which is applied in the field of infrared detectors and can solve problems such as cracking, low compressive strength, and thermal mismatch.

Pending Publication Date: 2022-02-25
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Abstract
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  • Application Information

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Problems solved by technology

In addition, in order to improve the transmittance of the structure, the materials that can be selected when making the window are limited. It is likely that the thermal mismatch is caused by the difference in thermal expansion coefficient with the shell material, and the compressive strength of the material of the window itself is low. Fragmentation at low temperature

Method used

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  • Infrared detector packaging assembly and infrared detector with same

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Embodiment Construction

[0030] In order to further explain the technical means and functions adopted by the present invention to achieve the intended purpose, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0031] Such as figure 1 As shown, the infrared detector package assembly 100 according to the embodiment of the present invention includes: a housing assembly, a chip 20 and a lead ring 40 .

[0032] Wherein, the casing component defines a cavity S0, and the chip 20 is disposed in the cavity S0. The frame of the lead ring 40 constitutes an integral part of the housing assembly, that is, the frame portion of the lead ring 40 constitutes an integral part of the housing assembly, and jointly defines the chamber S0. The chip 20 is electrically connected to the lead ring 40 to electrically lead the chip 20 out of the chamber S0. Thus, the chip 20 can be connected to components outside the chamber S0 through the lead ri...

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Abstract

The invention provides an infrared detector packaging assembly and an infrared detector with same; the infrared detector packaging assembly comprises a shell assembly, a chip and a lead ring, the shell assembly defines a cavity, the chip is arranged in the cavity, a lead ring frame forms a constituent part of the shell assembly, and the chip is electrically connected with the lead ring. And the chip is electrically led out from the cavity. The shell assembly is a low-expansion alloy part, a window communicated with the cavity is formed in the shell assembly, and the window is covered with a sapphire window piece. According to the infrared detector packaging assembly, packaging is carried out in a tube shell mode, and the structure is compact. The shell assembly adopts a low-expansion alloy part, and has excellent mechanical strength, thermal conductivity and air tightness at low temperature. Moreover, the thermal expansion coefficient of the shell assembly of the low-expansion alloy piece at low temperature is close to that of the sapphire window piece, the stress of the sapphire window piece at low temperature can be effectively reduced; in addition, the sapphire window piece is high in compressive strength and can achieve high transmittance.

Description

technical field [0001] The invention relates to the technical field of infrared detectors, in particular to an infrared detector package assembly and an infrared detector having the same. Background technique [0002] Cooled infrared detectors generally use micro-Dewar packaging, but according to the cooling method or the requirements of the system coupling platform, infrared detectors in the form of tube and shell packaging are becoming more and more common, and the packaging structure is also moving towards the direction of easy production and maintenance and standardization develop. Compared with the infrared detectors on the ground background, the light signals detected by the infrared detectors in the deep space background are extremely weak, so the transmittance of the window when the detector is packaged is required to be higher. [0003] In addition, in order to enhance the detection sensitivity, the overall structure works at a low temperature of 40K, which require...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0203H01L31/024H01L31/09
CPCH01L31/0203H01L31/024H01L31/09
Inventor 田亚刘兴新王冠付志凯
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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