Prediction method of thermal fatigue life of BGA (Ball Grid Array) welding spot considering influence of sequential temperature cycling load loading

Abstract

The invention discloses a prediction method of a thermal fatigue life of a BGA (Ball Grid Array) welding spot considering an influence of sequential temperature cycling load loading. The method comprises the steps of 1, analyzing the influence of the sequential temperature cycling load loading on the thermal fatigue life of the BGA welding spot, and a reason; 2, improving a Darveaux model according to the influence of the sequential temperature cycling load loading on the thermal fatigue life of the BGA welding spot and by reference to a Paris formula and building a prediction model of the thermal fatigue life of the BGA welding spot considering the influence of the sequential temperature cycling load loading; 3, determining a fit determination method of parameters in the prediction model of the thermal fatigue life of the BGA welding spot considering the influence of the sequential temperature cycling load loading; 4, performing analysis verification on the prediction model of the thermal fatigue life of the BGA welding spot considering the influence of the sequential temperature cycling load loading, and separately performing contrast analysis on fatigue life prediction results of the prediction model of the thermal fatigue life of the BGA welding spot considering the influence of the sequential temperature cycling load loading and the Darveaux model under a single temperature cycling load condition, and performing contrast analysis on fatigue life prediction results of the prediction model of the thermal fatigue life of the BGA welding spot considering the influence of the sequential temperature cycling load loading and the Miner theory under a sequential temperature cycling load loading condition; and 5, completing building of the prediction method.

Description

technical field [0001] The invention relates to a method for predicting the thermal fatigue life of BGA solder joints considering the impact of sequential loading of different temperature cycle loads, and belongs to the technical field of failure physics. Background technique [0002] With the continuous development of electronic packaging technology, the field of application of electronic products is becoming more and more extensive, and the environmental conditions encountered in the use of electronic products are becoming more and more complex and harsh. There may be sudden changes in the environment, changes in working modes, etc., so that electronic products are loaded in sequence. under load conditions. BGA solder joints (ball grid array package solder joints) are a key link to ensure the reliability of electronic products, and the prediction and evaluation of their fatigue life is of great significance to products. However, for the most important thermal fatigue in s...

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Problems solved by technology

However, for the most important thermal fatigue in solder joint fatigue, the existing life prediction model under the condition of temperature cycle cannot consider the influence of load sequence when the loading conditions change, and the application of Miner theory to linear accumulation results will have large errors, and the corresponding The research work is very limited, and there is no mature method for easy application

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