Smart card carrier band and encapsulation method

Abstract

The invention provides a smart card carrier band and an encapsulation method. The smart card carrier band includes a plurality of carrier band units; each carrier band unit comprises a chip arrangement area and at least one pad area; the chip arrangement area is used for carrying a chip; each pad area includes a plurality of pads; the chip in the chip arrangement area is electrically connected with at least one pad; and the chip arrangement areas and all the pad areas are arranged in a manner that the chip arrangement areas and all the pad areas are parallel to the forwarding direction of the smart card carrier band. According to the smart card carrier band and the encapsulation method of the invention, in the same carrier band width, the distribution density of the carrier band units can be improved by at least 30%, so that the utilization rate of the carrier band can be increased; the number of encapsulated chips can be increased, and encapsulation efficiency can be improved; bridge wiring is adopted as for long welding lines, so that arc height of the welding lines can be decreased, and therefore, the height of an encapsulated encapsulation body can be deceased at least by 50 micrometers, and thin encapsulation can be realized.

Description

technical field [0001] The invention relates to the field of smart cards, in particular to a smart card carrier tape and a packaging method. Background technique [0002] The current smart card loading settings are as follows: figure 1 As shown, the carrier tape 10 includes a plurality of carrier tape units 11, the pad area 12 and the chip placement area 13 of each of the carrier tape units 11 are arranged parallel to the advancing direction of the carrier tape 10, and the carrier tape 10 The direction of progress is as figure 1 As shown by the middle arrow, where GND represents the ground pad. The shortcoming of the arrangement of this carrier tape unit 11 is, in the carrier tape 10 width direction, the quantity of the carrier tape unit 11 that places is less, makes the carrier tape 10 utilization rate low, the carrier tape unit 11 in the carrier tape 10 width direction The density is low, and the number of chips to be packaged at the same time is small, and the packagin...

AI Technical Summary

Problems solved by technology

The shortcoming of the arrangement of this tape carrier unit 11 is that, in the width direction of the carrier tape 10, the quantity of the tape carrier unit 11 placed is less, so that the utilization rate of the carrier tape 10 is low, and the tape carrier unit 11 in the width direction of the carrier tape 10 The density is low, and the number of chips to be packaged at the same time is small, and the packaging efficiency is low

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