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Thermally conductive flame retardant polymer compositions and uses thereof

A thermoplastic polymer and composition technology, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of limited freedom of design and high cost of ceramic fillers

Active Publication Date: 2015-08-19
SHPP GLOBAL TECH BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the use of ceramic fillers with high thermal conductivity is costly and the design freedom to control other properties such as mechanical properties, flow and thermal stability is limited

Method used

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  • Thermally conductive flame retardant polymer compositions and uses thereof
  • Thermally conductive flame retardant polymer compositions and uses thereof
  • Thermally conductive flame retardant polymer compositions and uses thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0069] Table 1 below provides a general description of the materials used in this application. These examples were performed to demonstrate the effect of metal hydroxides and polysiloxanes on the thermal conductivity of thermally conductive compositions.

[0070] Table 1

[0071]

[0072]

[0073] Tables 2 and 3 show the set temperatures used during compounding and molding operations. Extrusion was carried out in a twin-screw extruder with 10 barrels and a die. Extrusion conditions are shown in Table 2. As seen in Table 2, Comparative Sample (C1 ) and Samples #1-5 extruded under one set of conditions, while Comparative Sample (C2) and Samples #6-7 extruded under another set of conditions. Comparative Sample (C3) and Samples #8-9 were extruded under yet another set of conditions. All three sets of conditions are shown in Table 2 below.

[0074] Table 2

[0075] set temperature

C1，#1-#5

C2，#6-#7

C3，#8-#9

Inlet zone temperature

℃...

Embodiment 2

[0092] Tables 7 to 9 detail compositions comprising the same components as the samples shown in Tables 4 to 6, but the weight percentages are different, and the compositions apparently include the anti-dripping agent polytetrafluoroethylene (PTFE). Table 7 details the composition, while Tables 8 and 9 detail the respective properties. The comparative composition (C2) did not contain any PTFE or PDMS. P(FTP) refers to the probability of first pass.

[0093] Table 7

[0094]

[0095] Table 8 details the properties after 48h aging at 23°C, while Table 9 details the properties after 168h aging at 70°C.

[0096] Table 8

[0097]

[0098] Table 9

[0099]

[0100] As can be seen from Table 8, the samples comprising PTFE and / or PDMS exhibited a P(FTP) of 1.0, while the comparative composition (ie, C2) did not exhibit the same flame retardant behavior.

Embodiment 3

[0102] Tables 10 to 12 detail compositions comprising blends of Nylon 6 (Domanid) and Nylon 66. The inventive composition contained significant anti-dripping agent polytetrafluoroethylene (PTFE), while the comparative composition (C3) did not. Table 10 details the composition, while Tables 11 and 12 detail the respective properties. P(FTP) refers to the probability of first pass.

[0103] Table 10

[0104]

[0105] Table 11

[0106]

[0107] Table 12

[0108]

[0109] Table 11 details the performance after aging for 48 hours at 23°C, while Table 12 details the performance after aging for 168 hours at 70°C. As can be seen from Tables 11 and 12, the samples containing PTFE and / or PDMS (silicone char former) exhibited a P(FTP) of 1.0, while the comparative composition (C3) did not exhibit the same flame retardant behaviour.

[0110] The present invention includes at least the following embodiments.

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Abstract

Disclosed herein is a thermally conductive composition, comprising 20 to 80 wt % of a thermoplastic or thermosetting polymer; 10 to 70 wt % of a metal hydroxide; and a polymeric char forming agent, where the polymeric char forming agent provides the thermally conductive composition with a flame retardancy of V-0 at a thickness of 1.5 millimeters or less when tested as per a UL-94 testing protocol; where the weight percents are based on a total weight of the thermally conductive composition.

Description

[0001] References to related applications [0002] This is a non-provisional application claiming priority to US Provisional Application No. 61 / 737,539, filed December 14, 2012, the entire contents of which are incorporated herein by reference. technical field [0003] The present disclosure relates to thermally conductive flame retardant polymer compositions. The invention also relates to methods of making these compositions and articles of manufacture comprising these compositions. Background technique [0004] The thermoplastic polymer composition is useful in various applications such as personal computer casings, display devices, electronic equipment materials, automotive exterior and interior parts, and the like. It is desirable for the polymers used in the aforementioned applications to be flame retardant while also being thermally conductive to dissipate and dissipate heat away from heat sensitive parts of the device. [0005] Flame retardant additives are often ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K5/5419C08K3/22C08L83/04
CPCH01L2924/0002C08K7/14C08L77/02C08K2201/001H01L23/3737C08K5/5419H01L23/295C08K3/22C08G77/04C08L77/00C08L77/06C08L83/04H01L2924/00
Inventor 国明成张亚琴安玉贤
Owner SHPP GLOBAL TECH BV