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Substrate carrying device

A substrate-carrying and substrate-based technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of high processing costs, low efficiency, and high surface shape requirements, so as to improve production efficiency and avoid winding and twisting Effect

Active Publication Date: 2015-09-02
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] U.S. Patent US6954269B2, titled "Annular suction cup compatible with 200mm and 300mm silicon wafers", but the patent does not explain how to be compatible with two different sizes of substrates. One possibility is: for two specifications of substrates with different When the suction cup is switched, the entire wafer holder is replaced. As we all know, the surface shape requirements of the suction cup are very high, and the processing cost is expensive, which undoubtedly increases a lot of cost and seriously reduces efficiency.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] figure 1 It is a schematic diagram of the system structure of the substrate inspection equipment, such as figure 1 As shown, the measuring head 106 is mounted on a mechanical support 107, and the mechanical support 107 may have different structures such as gantry or single-arm support. The wafer stage 105 is fixed on the Z-axis rotary stage Rz stage 104 and is located between the Rz stage 104 and the measuring head 106 . The Rz stage 104 is fixed on the adapter plate 103, and there may be some or all of the X-Y-Z direction adjustment stages 102 on the lower part of the adapter plate 103. The structural form of the mechanical support 107 and the number of X-Y-Z stages 102 do not affect the implementation of this solution.

[0036] The cross-sectional view of the internal mechanism of the wafer holder 105 of the present invention is as follows figure 2 and 3 As shown, two air pipes 208 pass through the adapter plate 103 and are connected to the pipe joint 207, and th...

Embodiment 2

[0042] replaceable, figure 2 The cylinder 205 in the cylinder can also be replaced by a hydraulic cylinder. Specifically, except that the gas source is replaced by a liquid source, its structure is exactly the same as that of the cylinder, except that the medium for execution is different, and the gas is replaced by liquid.

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PUM

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Abstract

The invention provides a substrate carrying device which is characterized by comprising the components of a substrate table which is used for carrying a substrate; a vacuum groove which is arranged in the substrate table and is internally provided with a plurality of vacuum channel holes for attracting the substrate; a rotating table which is arranged below the substrate table and is used for driving the substrate table to drive the substrate to rotate; an adapter which comprises an adapter upper part in the substrate table and an adapter lower part in the rotating table; a vacuum channel which is arranged in the adapter, wherein a vacuum source is connected with the vacuum groove through the vacuum channel; a bearing and a bearing seat which are arranged in the rotating table. The outer ring of the bearing is fixed with the substrate table through the bearing seat. The inner ring of the bearing is arranged outside the adapter. The substrate table rotates relative to the adapter through the bearing, so that when the substrate table rotates relative to the adapter, the adapter does not rotate and furthermore torsion of the vacuum channel is prevented.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a carrying device compatible with substrates of different sizes. Background technique [0002] In the semiconductor manufacturing process, it is usually necessary to inspect the film thickness, macro defects, micro defects, etc. of substrates such as silicon wafers and glass wafers. Correspondingly, there are detection equipment such as film thickness measurement, macro defect detection and micro defect detection. No matter what kind of detection equipment is used, it needs a carrier for fixing and clamping the substrate. The above-mentioned carrier is called a wafer holder. [0003] Some inspection equipment, such as scatterometry, macro defect inspection and other equipment, need to rotate the substrate during the inspection process, and are required to be compatible with a variety of substrates of different sizes. Currently, the commonly used substrate diam...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/687
CPCH01L21/68764
Inventor 江惟上
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD