Glue coating device special for thin film bonding machine

A glue coating device and bonding machine technology, which is applied to the surface coating liquid device, coating, etc., can solve the problem of uncontrollable glue volume and achieve the effect of avoiding defective products

Inactive Publication Date: 2015-09-09
DALIAN SHUNCHENG AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the amount of glue solution cannot be controlled during the bonding process of parts, the present invention provides a special gluing device for a film bonding machine

Method used

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  • Glue coating device special for thin film bonding machine
  • Glue coating device special for thin film bonding machine
  • Glue coating device special for thin film bonding machine

Examples

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Embodiment Construction

[0010] like Figure 1-Figure 3 As shown, the special gluing device of the film bonding machine includes height adjustment slide 1, bearing 5, pillar A6, servo motor 7, mounting base plate 8, servo motor mounting plate 9, pillar B10, bearing seat mounting plate 11, and rubber plate Mounting plate 12, rubber disc 13 and scraper plate 16, four pillars A6 are installed on the installation base plate 8, bearing seat mounting plate 11 is installed on the pillar A6, four pillars B10 are installed on the bottom of the bearing seat mounting plate 11, the pillars The bottom of the B10 is equipped with a servo motor mounting plate 9, and the bottom of the servo motor mounting plate 9 is equipped with a servo motor 7. The top of the servo motor 7 is connected to the rubber disc 13 through the coupling 15, and the top of the rubber disc 13 is provided with a scraper. 16. The scraping plate 16 is installed on the height adjustment slide 1, the height adjustment slide 1 is installed on the b...

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PUM

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Abstract

The invention discloses a glue coating device special for a thin film bonding machine. Supporting columns A are mounted on a mounting bottom plate, and a bearing pedestal mounting plate is arranged on the supporting columns A; supporting columns B are mounted at the bottom of the bearing pedestal mounting plate, and a servo motor mounting plate is arranged at the bottoms of the supporting columns B; a servo motor is mounted at the bottom of the servo motor mounting plate, and a glue disc is connected above the servo motor; a glue scraping plate is arranged above the glue disc, and is mounted on a height adjusting sliding table; the height adjusting sliding table is mounted on the bearing pedestal mounting plate, and the glue disc is sleeved with bearings; the bearings are mounted on the bearing pedestal mounting plate through a bearing pedestal, and a heat insulation plate is mounted on the bearing pedestal mounting plate; a glue disc mounting plate is mounted on the heat insulation plate, and a baffle is arranged in the glue disc mounting plate; and heating pipes are arranged in the baffle, and a glue disc is arranged on the glue disc mounting plate. The manner of carrying out manual bonding to control the glue liquid amount is effectively replaced, the glue liquid amount can be automatically and quantitatively controlled, time and labor are saved, appearing of defective products is avoided, and a customer feels satisfied.

Description

technical field [0001] The invention relates to the technical field of gluing equipment, in particular to a special gluing device for a film bonding machine. Background technique [0002] In the process of manual bonding of two parts, it is necessary to control the amount of glue used. Too much glue will cause the glue to overflow, resulting in defective products and waste of raw materials; too little glue, the parts will not be firmly bonded and easy to open, resulting in defective products and customer complaints. Contents of the invention [0003] In order to solve the problem that the amount of glue solution cannot be controlled during the bonding process of parts, the invention provides a special gluing device for a film bonding machine. [0004] In order to solve the above-mentioned technical problems, the technical solution of the present invention is: a special gluing device for a film bonding machine, including a height adjustment slide table, a bearing, a pillar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C1/06B05C11/02B05C11/10
Inventor 王国强
Owner DALIAN SHUNCHENG AUTOMATION EQUIP
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