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Adhesive parts preparation device with adjustable preload

A technology for preparing devices and adhesive parts, which is applied in the field of material mechanics research, can solve problems such as uneven bonding, uncontrollable bonding performance of adhesive parts, and quantitative adjustment of pre-tightening pressure, and achieve the effect of avoiding lateral influence

Inactive Publication Date: 2018-04-03
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, there was no special support for the adhesive parts in the preparation process, and the quality of the adhesive parts could not be guaranteed, which easily caused problems such as: slipping and misalignment between layers, uneven bonding, and sticking of adjacent adhesive parts.
At the same time, for different bonding materials and adhesives, it is very important to provide an appropriate pre-tightening pressure during the preparation process, which will determine the final interface performance; however, the pre-tightening pressure cannot be quantified during the preparation of existing adhesive parts Adjustment, unable to control the adhesive performance of adhesive parts

Method used

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  • Adhesive parts preparation device with adjustable preload
  • Adhesive parts preparation device with adjustable preload

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Embodiment Construction

[0015] combine figure 1 and figure 2 :

[0016] The present invention is an adhesive preparation device with adjustable pre-tightening force, comprising a base 1, a partition plate 2 arranged on the base 1 that can slide along the length direction of the base panel and lock the position, and can be perpendicular to the base along the periphery of the base 1 The pressure plate 3 that the limit boss of the panel slides, and the weight plate 5 arranged on the top of the pressure plate 3, wherein, the part of the partition plate 2 beyond the base panel is smaller than the adhesive part 4 provided between the adjacent partition plates 2 Height, and greater than the height of the lower half of the bonding part 4.

[0017] The base 1 is composed of a base panel and support legs at the four corners of the base panel, and a partition sliding limit guide rail is arranged between the two support legs corresponding to the sliding direction of the partition plate 2 to cooperate with the...

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Abstract

The invention discloses an adhesive preparation device with adjustable pre-tightening force, which comprises a base, a partition plate arranged on the base that can slide along the length direction of the base panel and lock its position, and a partition plate that can be perpendicular to the base panel along the periphery of the base. The pressure plate on which the limit boss slides, and the weight plate arranged on the top of the pressure plate, wherein, the part of the partition board beyond the base panel is smaller than the height of the adhesive parts set between adjacent partition boards, and greater than the height of the adhesive parts. The height of the half. The invention can ensure that no sliding dislocation occurs between the layers of the bonding parts, the bonding pre-tightening pressure can be adjusted according to actual needs, and the bonding is uniform.

Description

technical field [0001] The invention belongs to the technical field of material mechanics research, in particular to an adhesive preparation device with adjustable pretightening force. Background technique [0002] With the continuous development of modern science and technology, bonding structures are more and more used in aerospace, vehicles, ships and other related equipment structures. Compared with traditional connection methods such as welding, screw connection, riveting, etc., the use of adhesive structure can well avoid problems such as stress concentration and damage to the adhered material. [0003] There are a large number of laminated bonded components in engineering, among which the bonding performance of the interface is particularly important for the stability of laminated bonded components. In the past, there was no special support for the bonding parts in the preparation process, and the quality of the bonding parts could not be guaranteed, which easily cau...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N1/28
Inventor 余家泉许进升郑健贾登蒋晶张中水韩龙
Owner NANJING UNIV OF SCI & TECH