A flip-type test fixture

Abstract

The invention relates to a novel tipping test tool. The test tool comprises a pedestal, an LCD fixing support and a tipping plate. The LCD fixing support is fixed on the pedestal. A left support plate and a right support plate are arranged on the pedestal. Fixed holes and multiple slopes are arranged in / on the left support plate and the right support plate. A rotation shaft connection block is arranged on the tippling plate. The tipping plate is connected to the fixed holes via the rotation shaft connection block and is capable of rotating around the fixed hole and stopping on the slopes via the rotation shaft connection block. The test tool is simple in structure, easy to manufacture and convenient to use, and precise and rapid positioning for a main plate in a test process is achieved. By use of the tipping main plate test technology, efficiency of for testing the main plate is increased. The main plate can be easily connected with an external connector, so it can be easier to judge whether functions of the connector connecting an external device are effective.

Description

technical field [0001] The invention relates to a test fixture, in particular to a test fixture which can always be turned over later. Background technique [0002] Conventional motherboard testing technology usually makes test fixtures and implants needles on the upper and lower molds, collects test data on the motherboard through probes, and analyzes whether the circuits and functions of the motherboard are qualified. This test fixture is mainly composed of an upper mold and a lower mold. The upper mold includes a carrier plate, a pressure rod plate, a needle plate, and a linkage pressing mechanism. The lower mold includes a needle plate and a fixture base. The test points on the board collect signals, which can accurately locate which network on the main board, which electronic component has a problem, and its shortcoming is that it cannot judge whether the function of the connector connected to the external device is qualified. [0003] In view of the above-mentioned de...

AI Technical Summary

Problems solved by technology

This test fixture is mainly composed of an upper mold and a lower mold. The upper mold includes a carrier plate, a pressure rod plate, a needle plate, and a linkage pressing mechanism. The lower mold includes a needle plate and a fixture base. The test point on the board collects signals, which can accurately locate which network on the motherboard, which electronic component has a problem, and its shortcoming is that it cannot judge whether the function of the connector connected to the external device is qualified.

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