Heat dissipation device
A heat dissipation device and heat dissipation plate technology, which is applied in cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve problems such as reflective silicon cracking, and achieve the effects of prolonging service life, simple structure, and reasonable design
Active Publication Date: 2015-09-16
天津众晶半导体材料有限公司
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Problems solved by technology
Because high-energy infrared light has high heat, the reflective silicon surface used to reflect the infrared light will inevitably accumulate high heat. If the heat cannot be dissipated in time, it is easy to cause the reflective silicon to break
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[0023] Such as Figure 1-3 As shown, a heat dissipation device includes a heat dissipation bottom plate 1, and the heat dissipation bottom plate 1 includes an upper surface 2, a lower surface 3, and a first surface 4, a second surface 5, and a third surface 6 located around the upper surface 2 and the lower surface 3. , the fourth surface 7, the fifth surface 8, the sixth surface 9, the seventh surface 10 and the eighth surface 11, the first surface 4 is arranged in parallel with the fifth surface 8, the third surface 6 is arranged in parallel with the seventh surface 10, The thickness of the heat dissipation bottom plate 1 is 20.0mm, the length of the first surface 4 and the fifth surface 8 is 51.0mm, the distance between the first surface 4 and the fifth surface 8 is 47.0mm, the third surface 6 and the seventh surface 10 The length of is 6.0mm, and the distance between the third surface 6 and the seventh surface 10 is 126.0mm;
[0024] The upper surface 2 of the heat dissip...
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The invention provides a heat dissipation device, and belongs to the technical field of heat dissipation equipment. The heat dissipation device comprises a heat dissipation bottom plate which has an upper surface, a lower surface, a first side, a second side, a third side, a fourth side, a fifth side, a sixth side, a seventh side and an eighth side, wherein the first side and the fifth side are arranged in parallel, and the third side and the seventh side are arranged in parallel. The upper surface of the heat dissipation bottom plate is provided with a groove, and the groove penetrates through the upper surface of the heat dissipation bottom plate. The middle layer of the heat dissipation bottom plate is provided with a first cut and a second cut. A first heat dissipation plate and a second heat dissipation plate are arranged in parallel on the lower surface of the heat dissipation bottom plate, the width of the first heat dissipation plate is equal to the length of the third side, the width of the second heat dissipation plate is equal to the length of the seventh side, and the longer side of the first heat dissipation plate and the longer side of the second heat dissipation plate are arranged oppositely. The heat dissipation device has the advantages of simple structure, reasonable design, convenient installation and disassembly, and high heat dissipation rate. By adopting the heat dissipation device, heat on the surface of reflective silicon can be dissipated out in time, high heat dissipation rate can be achieved, and the service life of reflective silicon can be prolonged.
Description
technical field [0001] The invention relates to the technical field of heat dissipation equipment, in particular to a heat dissipation device. Background technique [0002] Materials used to make infrared optics are known to be brittle, such as silicon. Whether they are single crystal or polycrystalline, no matter whether the crystal grains are large or small, they are not as strong as glass and cannot withstand long-term exposure to high-energy infrared light. Because high-energy infrared light has high heat, the reflective silicon surface used to reflect the infrared light will inevitably accumulate high heat. If the heat cannot be dissipated in time, it will easily cause the reflective silicon to break. Therefore, it is necessary to develop a heat dissipation device for dissipating the heat on the surface of the reflective silicon in time, which has a high heat dissipation rate and can prolong the service life of the reflective silicon. Contents of the invention [00...
Claims
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IPC IPC(8): H05K7/20H01L23/36
Inventor 薛佳伟薛佳勇王海军
Owner 天津众晶半导体材料有限公司