Spray assembly and wet etching equipment with the spray assembly

Abstract

The invention discloses a spray assembly and a wet etching apparatus with the same. The spray assembly includes a spray pipe. The spray assembly is characterized by further including a plurality of nozzles and a plurality of sealing blocks. The bottom of the spray pipe is equipped with multiple through holes. The nozzles are detachably connected to part of the through holes, and the sealing blocks are detachably connected to the rest through holes. The nozzles are communicated with a spray pipe fluid. The sealing blocks seal the corresponding through holes. The invention also discloses the wet etching apparatus, which includes a spray unit. The spray unit includes multiple above spray assemblies. The spray pipes of the spray assemblies are parallel to each other or approximately parallel to each other. The nozzles of the spray assembly can be detachably connected to the spray pipe, so spray uniformity can be improved by adjusting connection positions between the nozzles and the spray pipe if etching is not uniform locally in an etching process. Therefore, the production efficiency is improved, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor fabrication technology, in particular to a shower assembly and wet etching equipment with the shower assembly. Background technique [0002] In the process of manufacturing a thin film transistor liquid crystal display (Thin Film Transistor Liquid Crystal Display, TFT-LCD), the wet etching process is widely used. With the continuous upgrading of various processes of liquid crystal panels, there are more types of metal wires on TFT array substrates. From aluminum process to copper process and silver process, the wet etching process has an important impact on product performance and yield. There are two main etching methods of wet etching equipment: immersion mode and spray mode; the process of etching patterns in immersion mode is easy to control, and the etching rate of spray mode is faster. In the spray mode, the etching liquid is sprayed onto the surface of the object to be processed thro...

AI Technical Summary

Problems solved by technology

[0004] In the wet etching equipment with the above structure, the nozzle 1b and the spray pipe 1a are fixedly connected by welding, and the spray unit 2 composed of it is also single and fixed. When local etching is uneven in the etching process , can only replace all spray assemblies 1 (including spray pipe 1a and nozzle 1b) in the equipment, resulting in increased production costs

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