Lead-free solder scaling powder and preparation method thereof

Abstract

The invention discloses lead-free solder scaling powder and a preparation method thereof. The lead-free solder scaling powder comprises organic acid, nonionic surface active agents, silane, fatty acid, lithium amide, trialkyborane, carbon disulfide and rosin. The lead-free solder scaling powder can improve the wettability of Sn-Ag-Cu series lead-free solder and is environmentally friendly. In addition, the preparation method of the lead-free solder scaling powder is simple in step, and raw materials are easy to obtain.

Description

technical field

[0001] The invention relates to flux, in particular to a lead-free solder flux and a preparation method thereof. Background technique

[0002] Welding technology is widely used in industry, especially in the manufacturing process of electronic products, almost all kinds of welding methods are used, the commonly used welding is mostly soldering, and in soldering, the most commonly used and most effective The representative one is soldering. Soldering is to heat the electronic weldment and the solder with a lower melting point than the weldment to the soldering temperature. When the weldment does not melt, the solder melts and infiltrates the soldering surface through the action of the flux, relying on the metal atoms between the two The diffusion between them forms a new alloy composition and completes the connection of the weldment. During the whole welding process, the active substance in the flux plays a vital role in the welding. The active substance in ...