Multi-system combiner coupler

Abstract

The present invention discloses a multi-system combiner coupler which comprises a body shell. A first coupling cavity, a second coupling cavity, an empty cavity, and a combiner cavity are isolated in the body shell. The first coupling cavity is internally provided with a first directional coupler. The second coupling cavity is internally provided with a second directional coupler. The combiner cavity is internally provided with a combiner. According to the multi-system combiner coupler, through continuous tests and structural adjustment, the position setting of each cavity is determined, the best position of each cavity is determined, the reduction of mutual interference of each path of signal is ensured, and the characteristics of multi-system combination and coupling are realized. A whole substrate is used to make a device with three cavity, the device is covered by a cover plate to carry out debugging, an index requirement is debugged and the cover plate is fixed, and a complete and usable multi-system combiner coupling platform is formed, and the problems of uncertainty and large debugging difficulty of a traditional combiner system are overcome.

Description

technical field [0001] The invention relates to a multi-system combining coupler. Background technique [0002] At present, the multi-system combination platform is a very common system platform in the field of communication. The existing technology solutions to the multi-system combination platform are generally as follows: figure 1 As mentioned above, use 1 coupler (a2) to connect 4 40DB directional couplers (a1) through radio frequency connecting cables to form a patchwork multi-system combining platform. In this way, it has more certainties, such as technical indicators Problems, such as large loss, poor and unstable product intermodulation index, high cost, many components required for the product, more complex assembly processes, difficult debugging and low efficiency, etc., due to the tiny The difference in size will make the platform of the composed system have a large parameter difference, and it is difficult to adjust it into a stable multi-system combination devi...

AI Technical Summary

Problems solved by technology

[0002] At present, the multi-system combination platform is a very common system platform in the field of communication. The existing technology solutions to the multi-system combination platform are generally as follows: figure 1 As mentioned above, use 1 coupler (a2) to connect 4 40DB directional couplers (a1) through radio frequency connecting cables to form a patchwork multi-system combining platform. In this way, it has more certainties, such as technical indicators Problems, such as large loss, poor and unstable product intermodulation index, high cost, many components required for the product, more complex assembly processes, difficult debugging and low efficiency, etc., due to the tiny The difference in size will make the platform of the composed system have a large parameter difference, and it is difficult to adjust it into a stable multi-system combination device. In addition, the cost problem is prominent, not only because of the high cost of a single device, but also because in The waste of manpower in the continuous debugging process makes it costly, difficult to debug, and poor in stability

Images