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High-efficiency heat dissipation PCB

A kind of PCB board, high-efficiency technology, used in circuit thermal devices, printed circuit components, electrical components, etc., can solve problems such as poor heat dissipation effect, and achieve the effect of meeting the needs of use

Inactive Publication Date: 2015-10-21
CHANGZHOU DINGRUN ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiency of the poor heat dissipation effect of the existing PCB board, the present invention provides a PCB board with high heat dissipation

Method used

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  • High-efficiency heat dissipation PCB

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Embodiment Construction

[0012] Such as figure 1 It is a schematic diagram of the structure of the present invention, a PCB board with high heat dissipation, including a board 1, an inner row pipe 5 is arranged inside the board 1, the inner row pipe 5 is connected with an outer row pipe 6, and the board 1 is installed on On the fixed plate 2 , end plates 3 are provided at both ends of the fixed plate 2 .

[0013] According to another embodiment of the present invention, it further includes that the two ends of the fixing plate 2 are provided with end plates 3 .

[0014] According to another embodiment of the present invention, it further includes that a sealing ring 7 is provided at the contact position between the outer discharge pipe 6 and the fixing plate 2 .

[0015] According to another embodiment of the present invention, it further includes that the plate 1 is provided with a through hole 4 .

[0016] When this high-efficiency heat dissipation PCB board is in use, the heat generated by the el...

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PUM

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Abstract

The invention relates to the technical field of a PCB, and especially relates to a high-efficiency heat dissipation PCB. The high-efficiency heat dissipation PCB comprises a substrate, the substrate is internally provided with an inside exhaust pipe, the inside exhaust pipe is connected with an outside exhaust pipe, the substrate is installed on a fixation plate, the two ends of the fixation plate are each provided with an end plate, sealing rings are arranged at contact positions between the outside exhaust pipe and the fixation plate, and the substrate is provided with through holes. When the high-efficiency heat dissipation PCB is used, heat of an electronic component on the substrate is exhausted by use of the exhaust pipes, it is ensured that the temperature of the electronic component on the substrate is disposed at a normal work state, and the application demand is met.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a PCB board with high heat dissipation. Background technique [0002] PCB boards are widely used in electronic equipment, but electronic equipment tends to generate a lot of heat during use. If the heat cannot be dissipated in time, it will damage the electronic equipment and affect the service life of the board and equipment. Contents of the invention [0003] In order to overcome the disadvantage of poor heat dissipation effect of the existing PCB board, the present invention provides a PCB board with high heat dissipation. [0004] The technical solution adopted by the present invention to solve the technical problem is: a high-efficiency heat-dissipating PCB board, including a board, the inside of which is provided with an inner row of pipes, the inner row of pipes is connected to the outer row of pipes, and the board is installed on On the fixed plate, end plates are a...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0204H05K2201/064
Inventor 朱杰
Owner CHANGZHOU DINGRUN ELECTRONICS TECH CO LTD