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New cooling module with improved structure

A heat dissipation module and a new type of technology, applied in cooling/ventilation/heating transformation, instruments, computing, etc., can solve the problems of slow air flow, high manufacturing cost, and unsatisfactory heat dissipation effect, and achieve the goal of promoting air flow and accelerating heat dissipation Effect

Active Publication Date: 2019-05-21
KUNSHAN ANIL PRECISE METAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The heat sink is composed of several heat sinks arranged at intervals. The heating element is in contact with the heat sink of the heat sink and transfers the heat to the heat sink. The heat sink forms a heat dissipation channel and takes away the heat on the heat sink by air flowing in the heat dissipation channel Heat dissipation function. At present, the heat sink group of the electronic product server is arranged in parallel to form a square structure, a circular structure, a column structure, etc. The air duct of this structure is a horizontal or vertical linear structure. The flow in the air duct of the heat sink group is slow, the heat dissipation effect is not ideal, and the overall weight of the product is large, and the manufacturing cost is high

Method used

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  • New cooling module with improved structure

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Effect test

Embodiment

[0017] Embodiment: A new heat dissipation module with improved structure, including several groups of first and second heat dissipation single sheets 1, 2 with symmetrical structures and at least two connecting rods 3, the two connecting rods 3 are arranged in parallel and fixedly connected together A plurality of first and second heat dissipation single pieces 1, 2 are respectively sleeved on two connecting rods 3 in parallel and spaced apart, and the first and second heat dissipation single pieces 1, 2 are distributed symmetrically in one-to-one correspondence, the first 1. The second heat dissipation single pieces 1 and 2 are in an inclined state where the height of the side away from each other is higher than the height of the opposite side. There is a set gap between the first and second heat dissipation pieces. The arc-shaped edge on the circle, the heat dissipation module has a circular structure as a whole, and makes the whole product a center-symmetrical structure. Sin...

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Abstract

The present invention discloses a novel cooling module with an improved structure. The novel cooling module comprises a plurality groups of first and second single cooling fins with symmetric structures and at least two connecting rods, wherein the two connecting rods are arranged in parallel and fixedly connected together; a plurality of first and second single cooling fins are separately arranged in parallel on the two connecting rods at intervals in a sleeving manner; the first and second single cooling fins are respectively and correspondingly distributed in a symmetrical mode; the first and second single cooling fins are in an inclination state in which the sides deviated from each other are higher than the sides facing each other; a set clearance is formed between each first single cooling fin and each second single cooling fin; and the outer side edges of each first single cooling fin and the corresponding second single cooling fin are circular-arc edges on the same circle. The novel cooling module with the improved structure is integrally of a centrosymmetric circular structure, and two inclined sides of the first and second single cooling fins and the connecting rods form certain included angles, so that guiding heat shifts towards the center, and the air motion is facilitated at the same time; the first and second single cooling fins and the connecting rods are connected through run-through holes in the vertical planes, so that the products can be fully buckled on single sides, and the products are attractive in appearance and stable.

Description

technical field [0001] The invention relates to a heat sink, in particular to a novel heat dissipation module with improved structure applied to electronic product servers. Background technique [0002] The heat sink is composed of several heat sinks arranged at intervals. The heating element is in contact with the heat sink of the heat sink and transfers the heat to the heat sink. The heat sink forms a heat dissipation channel and takes away the heat on the heat sink by air flowing in the heat dissipation channel Heat dissipation function. At present, the heat sink group of the electronic product server is arranged in parallel to form a square structure, a circular structure, a column structure, etc. The air duct of this structure is a horizontal or vertical linear structure. The flow in the air duct of the heat sink group is slow, the heat dissipation effect is not ideal, and the overall weight of the product is large, and the manufacturing cost is high. Contents of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H05K7/20
Inventor 林志昆
Owner KUNSHAN ANIL PRECISE METAL